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Oligomer and thermosetting photosensitive resin composition

A photosensitive resin, oligomer technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of poor adhesion or flexure of solder mask ink to substrate and circuit

Inactive Publication Date: 2013-10-02
ONSTATIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although traditional flexible printed circuit boards have good heat resistance and solder resistance, after long-term or frequent flexing and use, the adhesion or buckling between the solder resist ink and the substrate and the circuit sex is not good

Method used

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  • Oligomer and thermosetting photosensitive resin composition
  • Oligomer and thermosetting photosensitive resin composition
  • Oligomer and thermosetting photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0030] Embodiment 1-7: preparation of photosensitive resin composition

[0031] The above-mentioned diol-based modified product (T1), cresol epoxy resin modified product (C1), bisphenol A epoxy resin modified product (C2) and novolac epoxy resin modified product (C3) according to Table 1 Mix and stir in the mixing ratios shown.

[0032] Table 1: Oligomers used in Examples and Comparative Examples

[0033]

[0034] Then, add photoinitiator respectively: 2-methyl-1-[4-(methylthio) phenyl]-2-morpholino propane-1-ketone (Irgacure 907, Ciba Company produces) 40g, 2-iso Prothioxanthone (ITX) 10 g, photosensitive monomer (pentaerythritol hexaacrylate) 50 g, defoamer (KS-66, manufactured by Shinetsu Corporation) 10 g, catalyst: melamine 10 g and (dicyandiamide (Dicy)) 1 g, and Additives: barium sulfate (B30, produced by Sakai company) 31.4g, silicon dioxide (R-972, produced by Degusa company) 40g and green colorant (phthalocyanine green) 3g, and put into three-roller grinder grin...

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Abstract

The invention provides an oligomer and a thermosetting photosensitive resin composition. The oligomer is characterized by comprising a resultant of a reaction of a double-alcohol group compound, a polyatomic alcohol compound, an acid dianhydride compound and a double-bond compound with an alcohol group.

Description

technical field [0001] The invention relates to a photopolymerizable and thermosetting photosensitive resin composition, and in particular to a photosensitive resin composition applied to a flexible printed circuit board. Background technique [0002] The printed circuit board is the main support for the installation and interconnection of electronic components, and is an indispensable part of all electronic products. [0003] In recent years, due to the needs of the mobile phone and flat panel display industries, the demand for thin and light flexible printed circuit boards (Flexible Printed Cicuit; FPC) has increased significantly. Furthermore, due to the development of electronic products towards thinner, smaller, portable, high-function, high-density, and the demand for high I / O count, miniaturization, and small area of ​​electronic structures, the requirements for the characteristics of the materials used are gradually becoming stricter. Harsh. [0004] In the flexibl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G63/21C08F283/01C08F2/50C08L67/07G03F7/028
Inventor 林松香曾朝辉庄碧阳
Owner ONSTATIC TECH
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