Recycling and recycling method of waste electronic components
A technology of electronic components and components, which is applied in the field of recycling and reuse of waste electronic components, can solve the problems of secondary pollution, low recycling rate, and difficult disposal, and achieve complete recycling, high recycling rate, and no waste. The effect of secondary pollution
Inactive Publication Date: 2011-12-21
BEIHANG UNIV
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] The purpose of the present invention is to solve the problems of difficult disposal of electronic components dismantled from existing waste circuit boards, low recycling rate, and secondary pollution, and proposes a method for recycling and reusing waste electronic components. The method specifically includes the following steps:
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0045] Example: The electronic components disassembled from a waste circuit board include resistors, capacitors, inductors, transistors and integrated circuits, etc., and these components are recycled and reused. The steps are as follows:
[0046] Step one, classification.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More
Abstract
The invention discloses a method for recycling and reusing waste electronic elements, comprising the following four steps: firstly, carrying out a functional classification on electronic elements, anddirectly recycling the elements with functions to reuse and carrying out a material grade classification on the elements without functions; secondly, crushing the electronic elements without functions; thirdly, selecting and separating the crushed materials; and fourthly, recycling and reusing a metal enrichment body and a non-metal enrichment body. In the invention, classification and recycle are carried out according to the characteristics of the electronic elements through crushing, magnetically selecting, electrostatic separating and centrifugation separation, and the waste electronic elements can be recycled and reused in a resource utilization with high utilization of recycling and without secondary pollution.
Description
technical field [0001] The invention belongs to the technical field of recovery and reuse, and specifically refers to a method for recovery and reuse of waste electronic components. Background technique [0002] Electronic components are mainly found on the circuit boards of various household appliances such as televisions, refrigerators, air conditioners, personal computers, mobile phones, game consoles, radios, and tape recorders in daily life. At present, the commonly used components include resistors, capacitors, inductive components, electrical contacts, diodes, transistors, integrated circuits, etc., and each component can be divided into several types, such as resistors can be divided into metal film resistors resistors, glass glaze resistors, wirewound resistors, etc. It can be seen that there are many kinds of electronic components and contain many kinds of materials. Among these materials, such as lead, cadmium, bromide, etc., are harmful to the environment and h...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B09B5/00B09B3/00
CPCY02W30/82
Inventor 吴国清赵玉振李琳吴超章
Owner BEIHANG UNIV
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com