Method for measuring focal plane uniformity of exposure machine

A focal plane and uniformity technology, which is applied in the field of measurement of the focal plane uniformity of exposure machines in semiconductor manufacturing, can solve the problems of less sampling, insufficient representation, and low measurement efficiency, so as to improve efficiency, sensitivity and accuracy , Overcome the single effect of graphics
CN101650534AActive Publication Date: 2010-02-17SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Publication Date
2010-02-17

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Abstract

The invention discloses a method for measuring focal plane uniformity of an exposure machine, comprising: manufacturing a special mask of which a figure zone has a plurality of same table cell, wherein each table cell is provided with a plurality of typical figures; adopting the special mask, and utilizing an exposure machine to respectively expose different zones of one wafer; utilizing a defectdetection machine to automatically detect the defect condition of the exposed wafer which is used for measuring; according to the defect condition, combining the translational amount of a focal distance to calculate and obtain the focal plane uniformity of the exposure machine. The invention improves the sensitivity and the accuracy for measuring the focal plane uniformity of the exposure machine, improves the measuring efficiency and is favourable for maintaining the focal plane of the exposure machine and monitoring performance.
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Description

technical field

[0001] The invention relates to a method for measuring the uniformity of the focal plane, in particular to a method for measuring the uniformity of the focal plane of an exposure machine in semiconductor preparation. Background technique

[0002] With the rapid development of semiconductor technology and the continuous improvement of the integration level of integrated chips, the manufacturing process of chips has become increasingly complex. In order to ensure a good yield, the requirements for the entire process flow and equipment will be stricter. It makes it more difficult for people to control the process error. The photolithography process is an important link in the manufacture of semiconductor devices. Generally speaking, the photolithography process includes pre-treatment, photoresist application, Soft Bake, exposure, PEB, development, Hard Bake and other steps, and exposure is a very important step in the photolithography process. In the character...

Claims

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