Unlock instant, AI-driven research and patent intelligence for your innovation.

Apparatus and method for inspecting semiconductor device

A technology for semiconductors and equipment, which is applied in the field of devices for detecting semiconductor equipment, to achieve the effects of improving detection speed, improving reliability, and avoiding unstable loading

Inactive Publication Date: 2011-08-31
JT
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In particular, if the processes described for inspecting the outer surface of the semiconductor device and for inspecting the status of the markings are not performed efficiently, delays in the inspection process may result in overall operating inefficiencies losses, thereby reducing productivity
[0007]Furthermore, there is a problem that an abnormal loading state of the semiconductor device in the tray may cause malfunction of the device for detecting the semiconductor device or damage to the semiconductor device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for inspecting semiconductor device
  • Apparatus and method for inspecting semiconductor device
  • Apparatus and method for inspecting semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Hereinafter, an apparatus for inspecting a semiconductor device according to the present invention will be explained in detail with reference to the accompanying drawings.

[0043] figure 1 is a schematic diagram showing an apparatus for detecting a semiconductor device according to the present invention, figure 2 and image 3is showing figure 1 Schematic diagram of the structure of the transport tool for the device for testing semiconductor devices in , Figure 4 to Figure 6 is shown by figure 2 Schematic diagram of the acquisition process of the transport tool transporting the semiconductor device to acquire the image by the image detection unit, Figure 7 is showing figure 1 A schematic diagram of the structure of the second visual inspection unit of the device for inspecting semiconductor devices, and Figure 8 is a sectional view showing a loaded state detection unit.

[0044] Such as figure 1 and figure 2 As shown in , the device for sorting semico...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An apparatus for inspecting semiconductor device, relating to an apparatus for inspecting semiconductor device, and more particularly to an apparatus for inspecting semiconductor device for inspecting upper and lower external appearance of semiconductor device, the apparatus comprising: a transferring tool for transferring a plurality of semiconductor devices picked up by a plurality of pickers for picking up semiconductor device, the plurality of pickers being arranged in m columnsxn rows (m and n are a natural number not less than 2); and an image acquisition unit for acquiring image of lower external appearance of a plurality of semiconductor devices transferred by the transferring tool in order to inspect external state for semiconductor devices by analyzing image of lower external appearance of semiconductor devices, is disclosed.

Description

technical field [0001] The present invention relates to an apparatus for inspecting a semiconductor device, and more particularly, to an apparatus for inspecting a semiconductor device to inspect upper and lower outer surfaces of the semiconductor device. Background technique [0002] The semiconductor device after the packaging process is inspected through a burn-in test process and the like, and loaded onto user trays for distribution to the market. [0003] Also, marks such as serial numbers, manufacturer's logos, etc. are marked on the surface of the semiconductor device to be distributed through a marking process. [0004] In addition, a visual inspection process for inspecting the external form of the semiconductor device to check for damage, cracks or scratches, etc. of leads or ball grids, and also for inspecting the state of marks printed on the surface is performed. [0005] Meanwhile, since the processes for inspecting the outer surface of the semiconductor devi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L21/67259H01L21/67288H01L21/67271
Inventor 柳弘俊张元鎭
Owner JT