LED packager

A light-emitting diode, diode technology

Active Publication Date: 2010-03-03
TEKNOWLEDGE DEV
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Depend on Figure 1A It can be seen that in the known LED package 100, the rear surface of the LED chip 120 will be bonded to the circuit board 110, and part of the light emitted by the LED chip 120 will be transmitted towards the direction of the circuit board 110. Usually it needs to go through multiple reflections before it can leave the inside of the LED chip 120. During the process of various light rays being reflected, a large amount of light loss is unavoidable.
Therefore, there is still room for improvement in the luminous efficiency of the known LED package 100

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packager
  • LED packager
  • LED packager

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0043] Figure 2A Is a side view of the light emitting diode package according to the first embodiment of the present invention, and Figure 2B It is a three-dimensional schematic diagram of the light emitting diode package according to the first embodiment of the present invention. Please refer to Figure 2A versus Figure 2B The light emitting diode package 200 of this embodiment includes a carrier 210, a light emitting diode chip 220, and a plurality of conductors 230. The light emitting diode chip 220 has a front surface 220a, a back surface 220b, and a plurality of side walls 220c connected between the front surface 220a and the back surface 220b, and one of the side walls 220c of the light emitting diode chip 220 faces the carrier 210 and is connected to the carrier 210 . In addition, the conductor 230 is electrically connected between the carrier 210 and the LED chip 220.

[0044] In this embodiment, the carrier 210 may be a circuit board with a plurality of pads 212, and...

no. 2 example

[0052] image 3 It is a side view of the light emitting diode package according to the second embodiment of the present invention. Please refer to image 3 The light emitting diode package 300 of this embodiment is similar to the light emitting diode package 200 of the first embodiment, but the main difference between the two lies in: the light emitting diode chip 320 and the light emitting diode chip 220 used in this embodiment. In detail, the LED chip 320 has a plurality of electrodes 322 and 324, and the electrodes 322 and 324 are respectively distributed on the front surface 320a and the back surface 320b of the LED chip 320. In addition, the electrodes 322 and 324 are electrically connected to the carrier 210 through the conductors 230 located on both sides of the LED chip 320, respectively.

no. 3 example

[0054] Figure 4 It is a side view of the light emitting diode package according to the third embodiment of the present invention. Please refer to Figure 4 The light emitting diode package 400 of this embodiment is similar to the light emitting diode package 300 of the second embodiment, but the main difference between the two is that the number of light emitting diode chips 320 used in this embodiment is multiple ( Figure 4 3 are shown in the middle). In detail, since the LED chips 320 are connected to the carrier 210 through the sidewall 320c, the distance between the LED chips 320 (the distance between the centers of the two LED chips 320) can be effectively shortened, and the The light mixing efficiency. In other words, on the carrier 210 of the same area, this embodiment can accommodate a larger number of light-emitting diode chips 320 to easily meet the requirements of high brightness output.

[0055] It is worth noting that in this embodiment, optical elements (such ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an LED packager comprising a carrier, an LED chip and a plurality of conductors, wherein the LED chip is provided with a front surface, a back surface and a plurality of side walls connected between the front surface and the back surface; one side wall of the LED chip faces the carrier and is connected with the carrier; and the conductors are electrically connected betweenthe carrier and the LED chip.

Description

Technical field [0001] The invention relates to a light-emitting diode package (light-emitting diode package, LED package), and in particular to a light-emitting diode package with good luminous efficiency. Background technique [0002] Light-emitting diodes (LEDs) are semiconductor components, and their materials mainly use III-V chemical elements, such as gallium phosphide (GaP), gallium arsenide (GaAs) and other compound semiconductors. The principle of light emission is to convert electrical energy into light. It is to apply current to the compound semiconductor, through the combination of electrons and holes, release the excess energy in the form of light, and achieve the effect of light emission. Since the light-emitting phenomenon of the light-emitting diode does not emit light through heating or discharge, the life of the light-emitting diode is more than one hundred thousand hours, and no idling time is required. In addition, light-emitting diodes have a faster response...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/075H01L23/488
CPCH01L2224/48091
Inventor 黄崇仁陈吉元卢叔东
Owner TEKNOWLEDGE DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap