Manufacturing method for multilayer stacking printed wiring board

Abstract

The invention provides a manufacturing method for a multilayer stacking printed wiring board, comprising the steps of: (1) providing the number of layers of printed wiring board and a circuit unit ofeach layer, (2) setting the number of key-line layout circuit units which are contained in each circuit layer of a secondary board, (3) arranging a symmetry axis of the secondary board and disposing the key-line layout circuit units in each layer as two groups of key-line layout circuit units along the two sides of the symmetry axis, (4) setting the number of circuit layer of the secondary board,(5) distributing the circuit of the secondary board, (6) fabricating the secondary board according to the distributed circuit, (7) fabricating a secondary outer layer dry film on the secondary board,(8) taking two secondary boards, keeping one fixed and rotating the other for 180 DEG along the symmetry axis, respectively stacking the key-line layout units of the two secondary boards, and then fabricating a motherboard by secondary laminating. By adopting the design of male and female key-line layout, the invention can solve the problem of scrapping the products by avoiding the layer deflection caused by the swelling and contraction variance of the secondary board during secondary laminating, to promote the product percent of pass and decrease the manufacturing cost.

Description

technical field [0001] The invention relates to a method for manufacturing a multi-layer superimposed printed circuit board, in particular to a method for manufacturing a multi-layer superimposed printed circuit board using a yin-yang imposition design. Background technique [0002] In recent years, with the popularization of electronic products, the demand for printed circuit boards is also increasing. At the same time, with the miniaturization of electronic products, the requirements for high density of printed circuit boards are also increasing. Therefore, Existing printed circuit boards usually have a multi-layer structure and the circuits inside are becoming more and more dense. [0003] The printed circuit board of the existing multi-layer stacked product (Sequential Lamination) is made by making two different sub-boards respectively, and then pressed together, and the process design is difficult (such as the minimum distance from the annular ring to the copper positio...

AI Technical Summary

Problems solved by technology

[0003] The printed circuit board of the existing multi-layer stacked product (Sequential Lamination) is made by making two different sub-boards respectively, and then pressed together, and the process design is difficult (such as the minimum distance from the annular ring to the copper position (clearance) / hole-to-line distance = 7.6mil / 6.8mil), and its process is more complex, resulting in local expansion and contraction of the production board product during the process or inconsistent expansion and contraction between the two sub-boards, resulting in the problem of layer deviation and scrapping, increasing product production cost

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