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Void-containing resin molded product, process for producing the void-containing resin molded product, and image receiving film or sheet for sublimation transfer recording material or thermal transfer

A technology of resin molded body and molded body, applied in the direction of copying/marking method, printing, coating, etc., can solve the problem of increased device cost, etc., and achieve the effect of excellent printing characteristics

Inactive Publication Date: 2010-03-03
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] However, in order to impregnate the film with an inert gas under pressure, a large-scale device that processes the entire film at a high pressure of tens of atmospheres or more than 100 atmospheres is required, and the equipment cost is higher than that of ordinary melt film forming and stretching equipment. Substantial increase in problems
In addition, there is a problem that since a large amount of inert gas is handled, equipment and countermeasures for ensuring the safety of the operator are required, which also requires considerable cost.

Method used

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  • Void-containing resin molded product, process for producing the void-containing resin molded product, and image receiving film or sheet for sublimation transfer recording material or thermal transfer
  • Void-containing resin molded product, process for producing the void-containing resin molded product, and image receiving film or sheet for sublimation transfer recording material or thermal transfer
  • Void-containing resin molded product, process for producing the void-containing resin molded product, and image receiving film or sheet for sublimation transfer recording material or thermal transfer

Examples

Experimental program
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Effect test

preparation example Construction

[0085] In the production process of the void-containing resin molded body, the voids are usually oriented in the first stretching direction. Therefore, the "average length (r (μm)) of the voids in the thickness direction perpendicular to the orientation direction of the voids" corresponds to being perpendicular to the surface 1a of the resin molded body 1 containing voids and to the first A cross-section at right angles to the stretching direction ( Figure 2A The average thickness r of the cavity 100 in the A-A' cross section in Figure 2B ). In addition, "the average length of the voids in the orientation direction of the voids (L (μm))" corresponds to a length perpendicular to the surface of the void-containing resin molded article and parallel to the first stretching direction. Parallel sections ( Figure 2A The average length L of the cavity 100 in the B-B' profile in Figure 2C ).

[0086] It should be noted that the first stretching direction means a unidirectional...

Embodiment 1

[0138] Using a melt extruder, extrude PBT1 (polybutylene terephthalate 100% resin) with IV=0.72 at 245°C from a T-die, pass it through a casting drum and solidify it to obtain a polymer film with a thickness of about 120 µm . This polymer film is uniaxially stretched (longitudinal stretch).

[0139] Specifically, uniaxially stretched at a rate of 100 mm / min in a warming atmosphere at 40°C, and after confirming that necking occurs, further uniaxially stretched at a rate of 6000 mm / min in the same direction as the first .

Embodiment 2

[0141] In Example 1, the stretching temperature was set at 30° C., the thickness of the polymer film was about 50 μm, and the longitudinal stretching speed in the second stage was changed from 6000 mm / min to 12000 mm / min for stretching. In addition, A resin film was prepared in the same manner as in Example 1.

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Abstract

This invention provides a void-containing resin molded product having a high level of heat insulating properties, and a process for producing the void-containing resin molded product, and a image receiving film or sheet for a sublimation transfer recording material or a thermal transfer recording material, comprising a void-containing resin molded product and having excellent printing properties.The void-containing resin molded product is composed of a crystalline polymer only and has voids in its interior. The void-containing resin molded product is characterized by satisfying a requirementof X / Y ratio = not more than 0.27 wherein X represents the coefficient of thermal conductivity of the void-containing resin molded product, W / mK; and Y represents the coefficient of thermal conductivity of a polymer molded product which has the same thickness as the void-containing resin molded product, is formed of the same crystalline polymer as the crystalline polymer constituting the void-containing resin molded product but free from any void, W / mK.

Description

technical field [0001] The present invention relates to a cavity-containing resin molded article comprising only a crystalline polymer, a method for producing the same, and a developing film or sheet for a sublimation transfer recording material or a thermal transfer recording material. Background technique [0002] Resin film or sheet containing voids is used as a member of image recording paper for thermal transfer printers or for lighting in electronic equipment due to its properties such as heat insulation, cushioning, and light transmission (or light-shielding) Use components, etc. [0003] In recent years, with the development of personal computers (PCs) and network environments, and the popularization of electronic image memory devices such as digital cameras, technologies for hard copying images captured by these systems or products on tablets or the like are required. [0004] As the hard copy technology, a thermal transfer recording method (and a printer using the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/00B41M5/50B41M5/382B41M5/52
CPCB29C55/06C08J5/18B41M5/52B29C55/143C08J2367/02B29K2105/04B29K2067/006C08J9/22B41M5/382
Inventor 有冈大辅后藤靖友小仓彻佐佐木广树
Owner FUJIFILM CORP
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