Low temperature fireable paste composition for forming an electrode or wiring

一种组合物、电极的技术，应用在印刷元件电连接形成、分散在不导电无机材料中的导电材料、电路等方向，能够解决难以实现高分辨率电极图案、降低Ag粒子密合性和熔接性、缓慢固化速度等问题，达到优异电阻率特性、印刷特性优异、固化度优异的效果

Inactive Publication Date: 2013-05-08
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When such a conventional paste composition is heated and cured, a urethane compound is generated, and the generated urethane compound is a conductive powder, and the main problem is that the adhesion and weldability of the Ag particles used are greatly reduced.
In addition, due to the slow curing speed of this conventional paste composition, the widening phenomenon of the line width is caused, and it is difficult to realize a high-resolution electrode pattern (refer to Korean Patent Publication No. 10-2006-0049996 and No. 10-2008 -0024444, and Japanese Patent Laid-Open Nos. 2005-268239, 2006-48149, and 2007-224191)

Method used

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  • Low temperature fireable paste composition for forming an electrode or wiring

Examples

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Effect test

Embodiment 1～3、 and comparative example 1 and 2

[0047] The components described in the following Table 1 were used in corresponding amounts, and were mixed with a three-roll kneader to manufacture the target paste composition.

[0048] Next, resistivity, viscosity change, resolution, aspect ratio, substrate adhesion, strength after firing, etc. were measured for the produced paste composition, and the physical property measurement results are also shown in Table 1.

[0049] Table 1

[0050]

[0051] As can be seen from the above Table 1, the paste compositions of the present invention produced in Examples 1 to 3, compared with the compositions produced in Comparative Examples 1 and 2, not only exhibit significantly superior resistivity characteristics, stability, strength and Substrate adhesion, high resolution and high aspect ratio electrode patterns can also be achieved.

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PUM

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Abstract

The invention is directed to a paste composition used for forming an electrode or wiring, wherein it comprises a) a conductive powder; b) a cellulose binder; c) an acrylate monomer; d) a radical polymerization initiator; and e) a solvent, and it is curable at a low temperature when compared to the prior paste compositions and it has excellent hardness, electrical resistivity and stability so that it can be usefully used for forming an electrode or wiring for a solar cell, RFID (Radio Frequency Identification) or PCB (Printed Circuit Board).

Description

technical field [0001] The present invention relates to a paste composition for forming electrodes or wiring that can be fired at a low temperature, especially can be fired at a low temperature and has excellent resistivity characteristics and excellent stability, so that it can be used in solar cells, RFID (radio A thermosetting paste composition usefully used in the formation of Radio Frequency Identification) or PCB (Printed Circuit Board, Printed Circuit Board) electrodes or wiring, and a method of forming electrodes or wiring using the same. Background technique [0002] Conventional paste compositions for forming electrodes and wiring are produced by mixing conductive powder, epoxy-based binders, curing agents, solvents, and the like. [0003] When such a conventional paste composition is heated and cured, a urethane compound is generated, and the generated urethane compound is a conductive powder, which mainly has the problem that the adhesion and weldability of the A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01L31/042H05K3/40
CPCH01B1/22H05K1/095H01L31/022425Y02E10/50H01L31/04H05K3/40
Inventor 黄建镐郑镛埈高旼秀郑美惠
Owner DONGJIN SEMICHEM CO LTD
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