Method and device for forming line used for cutting

Abstract

The present invention provides a method and a device for forming a line used for cutting. The line with enough depth for cutting off the substrate can be formed on a more transparent substrate with low energy absorbing efficiency without thermal damage to a device substrate inlayed wherein. The method of the invention comprises the following steps: a first step, through relatively moving a pulse-shaped laser beam through performing Q switch driving to the substrate and a laser oscillator, only irradiating the pulse-shaped laser beam to a preset fine interval which sets the substrate edge on apreset cutting-off line on the substrate to one end; and a second step, through relatively moving the CW laser beam obtained by continuously driving the substrate and the laser oscillator, irradiating the CW laser beam to all intervals from one substrate edge to the other substrate edge on the preset cutting-off line that is set on the substrate.

Description

technical field [0001] The present invention relates to irradiating a transparent substrate (substrate) embedded with a device circuit with a laser beam of a predetermined wavelength generated from a laser oscillator, while moving the substrate relative to the beam, thereby forming a substrate cut on the substrate Methods and devices for scribing. Background technique [0002] Conventionally, in order to divide a substrate (wafer: wafer) embedded with a plurality of device circuits vertically and horizontally into individual circuit chips (chips), a method has been adopted in which scribe lines are formed in advance along planned dividing lines on the substrate. , the substrate is cut along the scribe line using a cutting device such as an expander. [0003] At this time, if a machining method using a cutter or the like is used to form the scribed line, particles will be generated to hinder the subsequent steps. Therefore, the following method has been used in the past. A ...

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Problems solved by technology

[0010] However, in the above-mentioned method of forming a scribing line for cutting using a pulsed laser beam, although thermal influence can be minimized, conversely, in order to form a sufficiently deep scribing line, the power of the laser beam still needs to be greatly increased. If the thermal influence on the device circuit is considered, there is still a problem that it is difficult to ensure sufficient depth.

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