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Manufacturing and assembling method of semiconductor chip with consumption type metal-based core carrier

An assembly method and metal-based technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as inability to meet user requirements

Inactive Publication Date: 2010-03-24
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] Considering the current known development stages and limitations of semiconductor chip assembly, it is necessary to design a cost-effective packaging method that can provide an excellent manufacturing platform and is reliable. Known technology cannot meet the needs of users in actual use

Method used

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  • Manufacturing and assembling method of semiconductor chip with consumption type metal-based core carrier
  • Manufacturing and assembling method of semiconductor chip with consumption type metal-based core carrier
  • Manufacturing and assembling method of semiconductor chip with consumption type metal-based core carrier

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Embodiment Construction

[0079] The present invention is a method for manufacturing and assembling a semiconductor chip with a consumable metal-based core carrier, which at least includes the following steps:

[0080] (A) A multi-layer build-up carrier is provided, and the multi-layer build-up carrier includes a build-up carrier and a metal-based core carrier, wherein the build-up carrier includes a first surface and an opposing The second surface, and the first surface faces the first direction, contacts the metal-based core carrier from the second surface, and extends vertically outside the metal-based core carrier in the first direction, and the build-up carrier sees through electrically connected through the metal-based core carrier;

[0081] (B) mechanically attaching a semiconductor chip to the multilayer build-up carrier, wherein the semiconductor chip includes a first surface and an opposite second surface, and the first surface of the semiconductor chip includes a electrode;

[0082] (C) fo...

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Abstract

A manufacturing and assembling method of semiconductor chip with consumption type metal-based core carrier. The assembling of semiconductor chip includes: adhering a semiconductor chip to a multilayerbuild-up with a metal-based core carrier. When the metal-based core carrier provides indispensable mechanical support for the assembling of semiconductor, each layers of the build-up layers providescircuit function. Finally, As the metal-based core carrier is a consumption object, it will be finally removed while the build-up layers are reserved.

Description

Technical field: [0001] The present invention relates to a method for manufacturing and assembling a semiconductor chip with a consumable metal-based core carrier, especially a method for assembling on a build-up layer carrier (Build-Up Layers) with a metal-based core carrier (Metal-Based Core Carrier) A method for an integrated circuit (Integrated Circuit, IC) chip. Background technique: [0002] Due to the improvement of integrated circuit functions, coupled with the requirements of signal integrity (Signal Integrity) and specification miniaturization (Smaller Form-Factor), a wide range of evolutionary packaging innovations, including flip chip (Flip Chip, FC) and chip size packaging (Chip-Scale Packaging, CSP). These technologies use a high-density interconnect (HighDensity Interconnect, HDI) carrier to effectively distribute the input and output signals from the IC to the board, so that the chip can be packaged in an extremely limited space. It can not only reduce the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/60H01L21/56
CPCH01L2224/16225H01L2224/73204H01L2224/92125H01L2224/32225
Inventor 林文强
Owner BRIDGE SEMICON