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Method and device for packaging polycrystalline bulk silicon

A polysilicon and filling device technology, applied in packaging, packaging food, packaging protection, etc., can solve the problems of increased pollutants, pollution of crushed polysilicon materials, and serious wear of plastic coatings, etc., to reduce pollution, reduce particle pollution, and improve productivity Improved effect

Inactive Publication Date: 2010-03-24
WACKER CHEM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can introduce undesirable metal contamination to the inner surface of the bag
Therefore, the unit cannot achieve <50pptw iron levels in the packaged polysilicon
[0012] Second, during bag filling of crushed polysilicon material, contact with the inside of the filling and bag forming tube can lead to contamination of the crushed polysilicon material
[0013] Thirdly, the high drop height of the crushed polysilicon material depending on the design, or the wear caused by the sharp-edged crushed polysilicon material would have such an effect that after packing about 100 tons of material, the plastic coating was worn so badly that Fill and bag forming tube parts must be replaced
[0019] Table 2: Contaminant increase in shredded polysilicon material with manual packaging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Example 1: Packaging according to the invention

[0073] Twenty batches of 5kg pieces of size 5, 4, 3, and 2 were filled into the vibration channel of the low-pollution lining and passed through a freely movable plastic tube (diameter 25cm) within 10 seconds. , The length is 15cm, the wall thickness is 5mm, and the inclination angle with the vibration channel is 90 degrees) is filled into a free-hanging high-purity PE bag, and the plastic tube extends into the PE bag (32cm wide, 45cm long, 300μ thick). After filling, the bag was sealed with a vacuum sealing device with Teflon coated welding wire under a vacuum of 500 mbar.

[0074] The filled bag is then manually put into the outer bag and welded by the method described above. After welding, each bag is introduced into the shipping box. Then seal the box.

[0075] To determine the penetration rate, first open the box and take out the bag, open and empty the bag. Each emptied bag is tested as follows:

[0076] Visually confi...

Embodiment 2

[0078] Example 2: Traditional packaging

[0079] In the same way, determine the penetration rate of the traditional, non-automatic packaging method. In the case of this method, one of the two bags is manually inserted into the other, followed by manual filling, manual welding, and loading into a shipping box.

[0080] Table 3 shows the comparison between the method of Example 1 (according to the invention) and Example 2 (comparative example).

[0081] table 3

[0082] Transmittance in%

[0083] Each bag is expressed in mmw

[0084] Table 3 shows that using the packaging method according to the present invention, compared with the traditional manual method with lower productivity, the penetration rate and hole mm of each bag 2 In terms of surface area, at least as good values ​​can be achieved for all silicon fragment sizes, and even better values ​​can be achieved for fragment sizes 5, 4, and 3. Therefore, the automatic packaging method according to the present invention can me...

Embodiment 3

[0085] Example 3: Packaging without removable plastic tube

[0086] Twenty batches of 5kg, size 5, 4, 3, and 2 pieces are filled into the vibration channel of the low-pollution lining, and directly filled into the free-hanging size 32cm wide within 10 seconds , 45cm long, 300μ thick PE double-layer bag. The difference from Example 1 is that no plastic tube is used. After filling, the bag was sealed with a vacuum sealing device with Teflon coated welding wire under a vacuum of 500 mbar. Use the method described in Example 1 to determine the penetration rate of each bag and the surface area of ​​the hole.

[0087] Table 4

[0088] Transmittance in%

[0089] Each bag in mm 2 Expressed

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PUM

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Abstract

The present invention relates to a method for packaging polycrystalline bulk silicon in which polycrystalline bulk silicon is filled into a freely suspended, completely formed bag by means of a filling device and the filled bag is subsequently sealed, characterized in that the bag is made of high-purity plastic having a wall thickness of 10 to 1000 microns.

Description

Technical field [0001] The invention relates to a method and a device for packaging crushed polysilicon materials. Background technique [0002] Polycrystalline silicon (polycrystalline silicon) is usually obtained by deposition of trichlorosilane by the Siemens method. Then, for applications in the solar energy industry, it is usually pulverized with low pollution, and for applications in the semiconductor industry, pulverization and The subsequent part is cleaned. Depending on the intended application, the pulverized polysilicon material obtained in this way may contain impurities of the highest metal elements described in Table 1 after packaging. [0003] Table 1: Maximum content of metal impurities [0004] 1.1.1 The value unit is pptw [0005] Material Feed Fe Cr Ni Na Zn Al Cu Mo Ti W K Co Mn Ca Mg V A < 50 < 20 < 10 < 100 < 20 < 30 < 10 < 10 < 100 < ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B25/00B65B29/00B65B39/12B65B55/24
CPCB65B29/00B65B39/12B65B25/00B65B55/24
Inventor H·沃赫纳B·利希滕格尔R·佩赫
Owner WACKER CHEM GMBH