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Wafer level capsulation mechanism and wafer level capsulation method used for radio-frequency micro electromechanical system

A micro-electromechanical system and wafer-level packaging technology, which is applied in the direction of microstructure technology, microstructure devices, processing microstructure devices, etc., can solve the problems of high price and need for drilling technology, and achieve the effect of reducing the impact

Active Publication Date: 2010-03-31
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing packaging scheme about RF MEMS is in Document 1 (Document 1: Entesari K., Rebeiz G.M., "A Low-Loss Microstrip Surface-Mount K-BandPackage", in Proceedings of the lst European Microwave Integrated Circuits Conference, EuMIC 2006, 2007, pp.537-540) mentioned the perforated packaging scheme, which has good high-frequency performance, but it requires a perforated process, which is limited in mass production applications due to its complicated process and high price; in Document 2( Literature 2: Carchon G.J., Jourdain A, "Integration of 0 / 1-LevelPackaged RF-MEMS Devices on MCM-D at Millimeter-WaveFrequencies", IEEE Transactions on Advanced Packaging 2007, v30, pp.369-376) mentioned large The packaging scheme of direct flip-chip soldering with bumps limits its application due to the parasitic parameters and reliability problems of the bumps

Method used

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  • Wafer level capsulation mechanism and wafer level capsulation method used for radio-frequency micro electromechanical system
  • Wafer level capsulation mechanism and wafer level capsulation method used for radio-frequency micro electromechanical system

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Embodiment Construction

[0016] The principle of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] see figure 1 , RF MEMS devices 1 and signal transmission lines 3 are arranged on the substrate 2; the substrate 2 is press-welded together with the top cover material 5 through the sealing material 4; there are bevels 10 around the substrate 2, the signal transmission lines 3 and the side wall leads 7 is laid on the bevel 10 and is further connected with the package top lead 8 to the solder ball 9 .

[0018] If the thickness of the sealing material 4 is less than 40 um, the top cover material 5 is provided with a cavity 6 .

[0019] see figure 2 , the signal transmission line 3 on the top cover material 5 reduces the impact by corroding the cavity 6 in the top cover material 5; if the signal transmission line 3 on the sealing material 4 is not long, that is, less than 200 microns, it does not need to be redesigned, if it is determined If t...

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Abstract

The invention discloses a wafer level capsulation mechanism and a wafer level capsulation method used for a radio-frequency micro electromechanical system. An RF MEMS apparatus with capsulation is connected to a welding ball 9 through a side lead by using surface micro machining technology and three-dimensional photoetching technology so as to realize the capsulation, avoid the process of drillingthrough holes in the conventional RF MEMS capsulation, protect structures of movable parts of the apparatus effectively and form a sealing environment. Thus mass production of the RFMEMS apparatus and normal work of the apparatus are ensured.

Description

technical field [0001] The invention relates to the technical field of packaging of radio frequency micro-electro-mechanical systems (RF MEMS), in particular to a wafer-level packaging mechanism and method for radio-frequency micro-electro-mechanical systems. Background technique [0002] Radio frequency microelectromechanical system (RF MEMS) was born in the 1990s. It is a research hotspot developed on the basis of the development and mutual intersection of radio frequency communication technology and MEMS technology. [0003] Due to the rapid development of RF MEMS research in recent years, various high-performance RF MEMS devices have been reported one after another. But different from integrated circuits, there is not a very good solution for the packaging of RF MEMS devices at present, which is mainly determined by the characteristics of RF MEMS devices themselves. First of all, generally speaking, RF MEMS devices have a movable floating part, which cannot be damaged d...

Claims

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Application Information

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IPC IPC(8): B81B7/00B81C3/00
Inventor 刘泽文王政李祥尹明
Owner TSINGHUA UNIV
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