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A multilayer pwb and a method for producing the multilayer pwb

A multi-layer printing, layer-by-layer technology, applied in the directions of printed circuits, waveguides, electrical components, etc., can solve problems such as PWB thickness, and achieve the effect of reducing manufacturing costs and thickness

Inactive Publication Date: 2010-03-31
SONY ERICSSON MOBILE COMM AB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventors have realized that a disadvantage of the above-described PWB structure at the state of the art is that the PWB becomes unnecessarily thick

Method used

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  • A multilayer pwb and a method for producing the multilayer pwb
  • A multilayer pwb and a method for producing the multilayer pwb
  • A multilayer pwb and a method for producing the multilayer pwb

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Embodiment Construction

[0035]Embodiments of the present invention relate to the field of PWBs, and more particularly to the field of multilayer PWBs for radio frequency applications. A preferred embodiment relates to a multi-layer PWB suitable for implementation in a portable communication device such as a mobile phone. However, it should be understood that the invention is equally applicable to electronic devices which do not include any radio communication capability. However, for the sake of clarity and simplicity, most of the embodiments outlined in this specification relate to mobile phones.

[0036] Embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings that illustrate the embodiments of the invention. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and com...

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PUM

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Abstract

A multilayered printed wiring board, a multilayer PWB, and a method for manufacturing the same. The multilayer PWB comprises a first main surface (201) and an opposing second main surface (202), wherethe multilayer PWB has a height (h) being defined, by the distance from the first main surface to the opposing second main surface. The two surfaces and the height together define the thickness of the multilayer PWB. The multilayer PWB comprises a reference ground plane, a microstrip conductor (210) separated from the reference ground plane (230') by a first dielectric layer (250) and a striplineconductor (220) connected with the microstrip conductor and being separated from the reference ground plane (230' ') by a second dielectric layer (260). The reference ground plane is formed by two ormore different partial reference (230',230' ') ground planes positioned at different layers of the multilayer PWB. Furthermore, the reference ground plane is moveable from the first partial referenceground plane to the second partial reference ground plane when a signal current transits from the microstrip conductor to the stripline conductor, and vice versa.

Description

technical field [0001] The present invention relates to a printed wiring board (PWB) and a method for producing such a printed wiring board. More specifically, the present invention relates to a multilayer PWB having a first major surface and an opposing second major surface, wherein the height of the multilayer PWB is defined by the distance from the first major surface to the opposing second major surface . Together, these two surfaces and height define the volume or thickness of the multilayer PWB. The multilayer PWB includes a reference ground plane, a microstrip conductor separated from the reference ground plane by a first dielectric layer, and a stripline conductor connected to the microstrip conductor and separated from the reference ground plane by a second dielectric layer . Background technique [0002] At the end of the 1980's, the first commercially attractive mobile phones or terminals were introduced on the market. Since then, the mobile communication indu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/02H01P3/08
CPCH05K2201/09327H05K2201/09627H05K2201/09336H05K2201/0191H05K1/0253H05K1/0298Y10T29/49155
Inventor P·伦德尔S·埃斯基尔森T·阿尔伯格
Owner SONY ERICSSON MOBILE COMM AB