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Multifunctional magnetic control sputtering film plating device

A magnetron sputtering coating, multi-functional technology, used in sputtering coating, ion implantation coating, vacuum evaporation coating and other directions, to achieve the effect of expanding the scope of use, avoiding pollution, and facilitating maintenance and adjustment

Inactive Publication Date: 2010-05-19
王君
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the small magnetron sputtering devices currently on the market are difficult to meet the above requirements at the same time

Method used

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  • Multifunctional magnetic control sputtering film plating device
  • Multifunctional magnetic control sputtering film plating device
  • Multifunctional magnetic control sputtering film plating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] see figure 1 , figure 2 , in this embodiment, the substrate frame 3 is fixedly connected to the vacuum chamber top cover 2, and is suspended in the vacuum chamber. On the bottom surface of the disc 10 at the bottom of the rack 3, at a position corresponding to the substrate carrier 11, on the upper part of the disc 10, a heating device 12 is provided;

[0026] figure 1 , image 3 As shown, in this embodiment, in the vacuum chamber body 1a, on the position opposite to the substrate carrier 11, on the same circumferential position of the vacuum chamber body bottom plate, each magnetron sputtering target 5 is uniformly arranged; in order to meet the vertical According to the requirements of sputtering and confocal sputtering, the included angle of the target head of each magnetron sputtering target 5 in the direction toward the main axis of the vacuum chamber is adjustable from 0 to 45°; Baffle 18.

[0027] image 3 The shown magnetron sputtering target 5 with adjus...

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Abstract

The invention discloses a multifunctional magnetic control sputtering film plating device which is characterized in that a substrate frame is fixedly connected to a top cover of a vacuum chamber and suspended in the vacuum chamber, and the substrate frame is arranged to a structural form capable of rotating and lifting; a substrate carrier is arranged on the bottom surface of a disk arranged at the bottom of the substrate frame, and a heating device is arranged at a position corresponding to the substrate carrier and positioned above the disk; magnetic control sputtering targets are uniformly arranged in the body of the vacuum chamber at positions relative to the substrate carrier on the same circumference of a bottom plate of the vacuum chamber; the inclined angles of the target heads of the magnetic control sputtering targets facing towards the spindle direction of the vacuum chamber are 0-45 degrees and can be adjusted; and sputtering baffles capable of turning over are arranged on the target heads. The multifunctional magnetic control sputtering film plating device has compact structure, miniaturization arrangement and multiple functions of depositing a single film, multiple films and a compound film meanwhile.

Description

technical field [0001] The invention relates to a magnetron sputtering film coating device, more specifically, a method for depositing single-layer films, multi-layer films and composite films on substrates by means of vacuum magnetron sputtering. A multi-functional magnetron sputtering coating device for sputter cleaning, heating and bias application. Background technique [0002] Under vacuum conditions, the use of vapor deposition technology to plate thin films on the surface of substrates is an important way to obtain thin film materials with excellent mechanical properties and special physical / chemical properties. It is a research hotspot in the fields of materials science and physical science. The core problem of vapor deposition technology is to use the selected deposition method (such as magnetron sputtering, pulsed laser deposition, etc.) to obtain thin film materials with required properties on the surface of the substrate to be plated. [0003] The magnetron sput...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 王君杨林生
Owner 王君
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