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Image sensor and method for manufacturing thereof

An image sensor and image sensing technology, applied in semiconductor/solid-state device manufacturing, image communication, electric solid-state devices, etc., can solve problems such as photodiode short circuit, output image sensitivity reduction, image error, etc.

Inactive Publication Date: 2010-05-26
DONGBU HITEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the charge sharing phenomenon occurs, the sensitivity of the output image is reduced and image errors may occur
[0007] In addition, dark current and / or reduced saturation and sensitivity can occur due to the inconvenient movement of photocharges between the photodiode and the readout circuitry
[0008] Also, the contact plug connecting the readout circuit to the photodiode can cause a short circuit in the photodiode

Method used

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  • Image sensor and method for manufacturing thereof
  • Image sensor and method for manufacturing thereof
  • Image sensor and method for manufacturing thereof

Examples

Experimental program
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Embodiment Construction

[0019] Hereinafter, embodiments of an image sensor and a method for manufacturing the image sensor will be described with reference to the accompanying drawings.

[0020] In describing embodiments, it will be understood that when a layer (or film) is referred to as being "on" another layer or substrate, it can be directly on another layer or substrate, or there may also be middle layer. Further, it will be understood that when a layer is referred to as being 'under' another layer, it can be directly under, and one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0021] figure 1 is a sectional view showing the image sensor according to the first embodiment.

[0022] The image sensor according to the first embodiment may include: a readout circuit 120 located at the firs...

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PUM

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Abstract

Provided is an image sensor that comprises a readout circuitry, an electrical junction region, an interconnection, and an image sensing device. The readout circuitry is disposed at a first substrate. The electrical junction region is electrically connected to the readout circuitry at the first substrate. The interconnection is disposed in an interlayer dielectric disposed on the first substrate, and electrically connected to the electrical junction region. The image sensing device comprises a first conductive type layer and a second conductive type layer on the interconnection. The first conductive type layer is electrically connected to the interconnection through a contact plug passing through the image sensing device.

Description

technical field [0001] The invention relates to an image sensor and a manufacturing method thereof. Background technique [0002] Image sensors are semiconductor devices used to convert optical images into electrical signals. Image sensors can be roughly classified into charge coupled device (CCD) image sensors and complementary metal oxide semiconductor (CMOS) image sensors (CIS). [0003] During the fabrication of image sensors, photodiodes may be formed in the substrate using ion implantation. Since the size of the photodiode is reduced in order to increase the number of pixels without increasing the chip size, the area of ​​the light receiving portion is also reduced, resulting in a reduction in image quality. [0004] In addition, since the pile height is not reduced as much as the area of ​​the light receiving portion is reduced, the number of photons incident on the light receiving portion due to diffraction of light (referred to as Airy disk) also decreases. reduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/335H04N3/15H01L27/146H01L21/82H04N25/00
CPCH01L27/14636H01L27/14634H01L27/146
Inventor 黄俊
Owner DONGBU HITEK CO LTD