Silicon chip cleaning device of chemical and mechanical polishing equipment

Abstract

The invention provides a silicon chip cleaning device of chemical and mechanical polishing equipment, relating to the technical field of the chemical and mechanical polishing equipment. The silicon chip cleaning device of the chemical and mechanical polishing equipment is provided with a silicon chip positioning support which is fixed on a central plate, and a silicon chip positioning supporting and resetting device and a silicon chip rotating device are arranged on the central plate. The invention favorably solves the unsolved problems existing in the prior art for a long term. By adopting the silicon chip cleaning device, silicon chips can be accurately positioned as well as reliably cleaned and reset so that the silicon chips obtain high cleanliness and high-efficiency cleaning effect with less abandonment and cost reduction. The silicon chip cleaning device has wide purpose, is suitable for cleaning the silicon chip in each producing procedure of transistors and integrated circuits, is particularly suitable for cleaning the silicon chips polished by using a chemical and mechanical method, can greatly enhance the cleanliness of the surfaces of the polished silicon chips, and can be preferably used for the end point detection after polishing.

Description

Technical field [0001] The invention relates to the technical field of chemical mechanical polishing equipment. Background technique [0002] In the production of transistors and integrated circuits, almost every process has the problem of silicon wafer cleaning. The quality of silicon wafer cleaning has a serious impact on the performance of the device. Improper handling may cause all the silicon wafers to be scrapped and fail to make tubes. Or the manufactured device has poor performance, poor stability and reliability. Therefore, the development of a high-cleanliness and high-efficiency silicon wafer cleaning method is of great significance to those engaged in silicon wafer processing and the production of semiconductor devices. It is precisely because silicon wafer cleaning is the most important and frequent step in the manufacture of semiconductor devices, and its efficiency will directly affect the yield, performance and reliability of the device, so domestic and foreign r...

AI Technical Summary

Problems solved by technology

This is mainly because the particles and metal impurities on the surface of the polished wafer will seriously affect the quality and yield of the device. In the current integrated circuit production, due to the contamination of the surface of the silicon wafer polished wafer, more than 50% of the materials are still contaminated. lost

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