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High-temperature solidification bonding method of spacer and plate in plate type heat exchanger

A plate heat exchanger, high temperature curing technology, applied in the direction of heat exchanger shell, indirect heat exchanger, heat exchanger type, etc., can solve the problems of unprofessional personnel, weak bonding performance, easy deformation, etc. The effect of reducing the cost of use, saving social wealth, and stabilizing the bonding performance

Active Publication Date: 2012-11-07
SIPING VIEX HEAT EXCHANGE EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the above method are: no firm bond can be formed between the gasket and the plate, the repeated disassembly and assembly of the gasket and the plate are easy to separate and deform, the disassembly and assembly pass rate is low, and the use of the plate and gasket Short life, high user cost
[0004] Ordinary bonded plates with gaskets can basically guarantee the performance when they are first assembled, but because of their weak bonding performance, when the plate heat exchanger is disassembled for cleaning and maintenance, most of the gaskets and plates are completely or partially separated , especially dismantling, cleaning and maintenance are basically done at the site of the equipment user unit, the site assembly facilities are incomplete, and the personnel are unprofessional, which makes the secondary assembly very difficult, the pass rate of the secondary disassembly is low, and the service life of the plates and gaskets is relatively long Low, increase the cost of user use, resulting in a great waste of social materials

Method used

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  • High-temperature solidification bonding method of spacer and plate in plate type heat exchanger
  • High-temperature solidification bonding method of spacer and plate in plate type heat exchanger

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Experimental program
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Embodiment Construction

[0021] The high temperature curing bonding method is achieved through the following steps:

[0022] 1. Cleaning process: After the plate is pressed and blanked, it is cleaned with alkaline water (using alkaline cleaning agent "degreasing two-in-one") to remove oil and other substances on the surface of the plate. The concentration of alkaline water is 7% to 10%, and it is heated To 100°C, wash for 40 minutes, then wash with clean water to remove the alkaline water on the surface of the plate, take it out, put it in a drying oven and dry it with hot air at 150°C, keep it for 30 minutes, take it out and lower it to room temperature, so that the surface of the plate is dry and clean.

[0023] 2. Glue application process: Take the 3M1469 glue of the American "3M" company from the 7°C freezer—referred to as 3M glue (3MScotch-Weld 1469 is a one-component epoxy resin adhesive, which has good high-temperature curing performance and has good adhesion to metals. Very high strength and i...

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Abstract

The invention relates to a high-temperature solidification bonding method of a spacer and a plate in a plate type heat exchanger. The method is realized by six process steps of a cleaning process, a gel coating process, spacer placement, plate stacking, high-temperature solidification processing and a plate lifting process. By adopting 3M gel of 3M company of American, the firm bonding can be formed between the spacer and the plate, the spacer and the plate are not separated and deformed by repeated assembly and disassembly, the rate of qualified assembly and disassembly is 100 percent, the service life of the plate and the spacer is improved, and the use cost of a user is reduced. By high-temperature solidification, the invention improves the strength of the plate and the temperature andcompression resistant capability of the spacer and plays a promoting role in ensuring the performance of the plate type heat exchanger.

Description

technical field [0001] The invention relates to a bonding process method between gaskets and plates of a heat exchanger, in particular to a high-temperature curing bonding method for gaskets and plates in a plate heat exchanger. Background technique [0002] The plate heat exchanger is characterized by its high efficiency, energy saving and compact structure, and has been widely promoted and applied. The plate in the plate heat exchanger is the core component. Different plate forms form different heat transfer modes and fluid modes, resulting in widely varying heat transfer performance. In the detachable plate heat exchanger, the gasket is also a major component, because its performance directly affects the overall performance of the heat exchanger, such as pressure bearing and temperature resistance. During assembly, the assembly process of plates and gaskets is particularly important. Its changes will be directly reflected in the performance of the plate heat exchanger, s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F9/26B05D7/24C23G1/14C23G5/00F28D9/00
Inventor 李汝勤
Owner SIPING VIEX HEAT EXCHANGE EQUIP
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