LED (Liquid Emitting Diode) white light bulb and production method thereof

Abstract

The invention provides an LED white light bulb, comprising a radiating base board, an LED chip, a glass shade, an insulating base and an electrode, wherein the LED chip is fixed on the radiating base board, the glass shade is bonded with the radiating base board, light emitted from the LED chip penetrates through the glass cover in which fluorescent powder is spread, the glass cover is filled with nitrogen or air, and the other surface of the radiating base board is connected with the insulating base connected with a lead electrode. The invention also provides a method for producing the LED white light bulb. The invention has the following advantages that the LED chip is directly fixed on the radiating base board, and heat generated during working of the chip is directly radiated by the radiating base board; the surface of the chip is not provided with a covering layer, and when the temperature of the chip is raised, stress releasing space is generated; glass materials can not be aged when the light passes through; and the spherical glass materials contribute to the reduction of total reflection.

Description

technical field [0001] The invention discloses an LED white light bulb and a manufacturing method thereof. In particular, it relates to a glass-encapsulated LED white light bulb and a manufacturing method thereof. Background technique [0002] At present, the realization of semiconductor lighting includes three methods: RGB three-color LED, ultraviolet LED+RGB phosphor (that is, the ultraviolet light emitted by the ultraviolet LED is used to excite red, green, and blue three-color phosphors to produce red, green, and blue light. , the three kinds of light are mixed to achieve white light), blue LED+yellow phosphor (that is, the blue light emitted by the blue LED is used to excite the yellow phosphor to produce yellow light, and the blue and green are mixed to achieve white light). For semiconductor lighting, the important problem is light attenuation. The current solution is to coat the phosphor powder on the LED chip, and then encapsulate the LED chip with epoxy resin or s...

AI Technical Summary

Problems solved by technology

[0005] (3) The light exits through the packaging material, and the photons interact with the packaging material, aging the packaging material and deteriorating the light transmittance

[0006] In order to overcome the problem of poor light transmission caused by the aging of organic packaging materials such as epoxy resin, the patent application number 200710050164.5 proposes to use glass materials instead of epoxy resin as the packaging material for LED chips, and use the stable chemical properties of glass materials to solve the problem of packaging materials. Aging problem, but high-power LED lighting often uses multiple high-power chips, and this patent is difficult to solve the problem of chip heat dissipation

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