A field effect transistor device using carbon nanotubes as electrodes and its preparation method
A field effect transistor and carbon nanotube technology is applied in the field of field effect transistor devices and their preparation to achieve the effects of high response sensitivity and high application value
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Embodiment 1
[0030] Example 1. Preparation of carbon nanotube transistor device
[0031] The preparation method of the carbon nanotube transistor device sequentially includes the following steps:
[0032] 1) Mesoporous SiO doped with CoMo 2 The particles act as a catalyst, and the catalyst is evenly distributed on the SiO on the surface of the heavily doped silicon substrate 2 Above the layer; the SiO 2 The layer is grown on the silicon wafer by thermal evaporation method with a thickness of 300nm; ethanol is used as the carbon source, and the CVD method is used in SiO 2 A single-walled carbon nanotube layer is obtained on the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0033] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by a thermal evaporation method, and Au / Cr is used as the source region and the drain region of the carbon nanotube transistor devic...
Embodiment 2
[0042] Example 2. Preparation of carbon nanotube transistor device
[0043] The preparation method of the carbon nanotube transistor device sequentially includes the following steps:
[0044] 1) Mesoporous SiO doped with CoMo 2 The particles act as a catalyst, and the catalyst is evenly distributed on the SiO on the surface of the heavily doped silicon substrate 2 Above the layer; the SiO 2 The layer is grown on the silicon wafer by thermal evaporation method with a thickness of 300nm; ethanol is used as the carbon source, and the CVD method is used in SiO 2 A single-walled carbon nanotube layer is obtained on the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0045] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by a thermal evaporation method, and Au / Cr is used as the source region and the drain region of the carbon nanotube transistor devic...
Embodiment 3
[0054] Example 3. Preparation of carbon nanotube transistor device
[0055] 1) Mesoporous SiO doped with CoMo 2 The particles act as a catalyst, and the catalyst is evenly distributed on the SiO on the surface of the heavily doped silicon substrate 2 Above the layer; the SiO 2 The layer is grown on the silicon wafer by thermal evaporation method with a thickness of 300nm; ethanol is used as the carbon source, and the CVD method is used in SiO 2 A single-walled carbon nanotube layer is obtained on the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0056] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by a thermal evaporation method, and Au / Cr is used as the source region and the drain region of the carbon nanotube transistor device. The distance between the two electrodes is 20 μm, the thickness of the Cr layer is 5 nm, and the thickness of t...
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