Heat dissipation cold plate and refrigeration system

Abstract

The invention discloses a heat dissipation cold plate and a refrigeration system. The heat dissipation cold plate includes a heat dissipation side wall, a first cavity, a first sleeve, a second cavity, an expansion unit and a second sleeve. The first cavity is covered on the heat dissipation side wall to form a first fluid space, and the first sleeve is connected to the first cavity. The second cavity is disposed in the first cavity and covered on the heat dissipation side wall to form a second fluid space. The expansion unit is disposed between the second cavity and the heat dissipation side wall to communicate with the first fluid space and the second fluid space. The second sleeve is disposed in the first sleeve and connected to the second cavity. In the heat dissipation cold plate and refrigeration system of the present invention, the temperature of the refrigerant in the first fluid space is higher than the dew point temperature to avoid condensation of water vapor, and the pressure drop effect of the expansion unit is used to make the refrigerant flow through the expansion unit into the second The temperature after the fluid space is lower than the dew point temperature to greatly improve the heat dissipation effect.

Description

technical field [0001] The present invention relates to a refrigeration system and its heat dissipation cold plate, and in particular to a condensation-free refrigeration system and its heat dissipation cold plate. Background technique [0002] With the evolution of integrated circuit (Integrated Circuit, IC) packaging technology and industrial manufacturing process, the packaging density and computing speed of integrated circuits in electronic components have been rapidly increased, and the high-speed operating frequency and shrinking circuit line width will make the electronic The heat generation of the components is relatively increased. Studies have shown that 55% of the damage to electronic products is caused by overheating, and the study also pointed out that reducing the temperature of the chip by 10°C can increase its computing efficiency by 1% to 3%. Life and stability are greatly affected. Therefore, an effective heat dissipation design can make the electronic co...

AI Technical Summary

Problems solved by technology

However, due to the characteristics of the refrigeration system that is lower than the ambient temperature, the water vapor in the air will condense, and the water droplets will cause the circuit system to be unstable or malfunction, so that the application of the refrigeration system to electronic heat dissipation is limited.

In particular, many dewdrops will condense on the surface of the heat dissipation cold plate that directly contacts the electronic chip, and when these dewdrops flow to the electronic chip or circuit board, it will cause the circuit system to be unstable or malfunction

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