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Radiating device

A technology of heat dissipation device and radiator, applied in heat exchange equipment, indirect heat exchanger, lighting and heating equipment, etc., can solve the problems of low heat dissipation efficiency and uneven heat distribution of heat dissipation device, and achieve high heat dissipation efficiency and increase The effect of thermal contact area

Inactive Publication Date: 2010-06-23
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using this cooling device, the heat pipe will first transfer the heat absorbed from the electronic components to the adjacent fin group parts around it, and then the heat will spread from near to far on the fin group, so that the heat is distributed in the fin group Not uniform, so the cooling efficiency of the heat sink is low

Method used

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  • Radiating device
  • Radiating device
  • Radiating device

Examples

Experimental program
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Embodiment Construction

[0009] Such as figure 1 As shown, the heat dissipation device according to an embodiment of the present invention is used to dissipate the heat generated by the electronic components (not shown) combined with it. The heat dissipation device includes a hollow cylindrical radiator 20 , a plurality of heat pipes 30 spirally surrounding the outer surface of the radiator 20 , a base 10 combined with the heat pipes 30 and a fan 40 arranged at one end of the radiator 20 .

[0010] Please also refer to figure 2 , the base 10 is integrally formed by metal materials with good thermal conductivity such as copper and aluminum, and has a curved surface 12 at the top and a flat surface 14 at the bottom. The curved surface 12 is in direct contact with the heat pipe 30 and is in contact with the radiator 20 The curvature of the curved surface 12 is consistent with the curvature of the heat pipe 30 in contact with it and the curvature of the outer surface of the heat conducting cylinder 22, ...

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Abstract

The present invention relates to a radiating device for the radiation of an electronic element, which comprises a base, a post radiator and at least one hot pipe, wherein the radiator comprises a heat conducting barrel and a plurality of fins arranged in the heat conducting barrel; the lower surface of the base contacts to the electronic element in a heat conducting way; at least one hot pipe is in a flat shape, and is wound at the outer surface of the hot pipe in a special shape, so a plurality of coils wound at the outer surface of the heat conducting barrel at interval is formed; and the upper surface of the base is connected with the hot pipe in the heat conducting way. The hot pipe of the radiating device is wound to one of the heat conducting barrel from the other along the circumference of the hot pipe, so the hot contact area of the hot pipe and the heat conducting barrel is increased. Heat on the base can be evenly conducted to the heat conducting barrel and the fins by the hot pipe, so the radiating efficiency of the radiating device is high.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from electronic components. Background technique [0002] The electronic components installed on the circuit board will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature, which will seriously affect the working performance and life of the electronic components. For this reason, a heat sink is usually installed on the electronic components to dissipate heat. [0003] A tower heat sink is a traditional heat sink, which generally includes a heat conduction plate in contact with electronic components, a fin set, and a number of heat pipes that are thermally connected to the heat conduction plate and the fin set. However, when using this cooling device, the heat pipe will first transfer the heat absorbed from the electronic components to the adjacent fin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/427H01L23/367
CPCF28D15/0233F28D15/0266H01L23/467F28F1/12H01L23/427H01L2924/0002H01L2924/00
Inventor 刘鹏
Owner FU ZHUN PRECISION IND SHENZHEN
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