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Low heat conduction light heat insulating silica brick

A low thermal conductivity, lightweight technology, applied in building components, buildings, building structures, etc., can solve the problems of high thermal conductivity, easy to collapse, easy to crack during firing, etc., to reduce thermal conductivity, improve brick strength, thermal insulation performance Good results

Inactive Publication Date: 2010-07-21
施富贤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional lightweight silica bricks have the following disadvantages: first, the volume is large, generally greater than 1.0; second, the apparent porosity is relatively high, resulting in a high thermal conductivity, greater than 0.5, and the silica brick is easy to burst when used
In practical applications, the bulk density of silica bricks should be less than 0.6, which is the best. To meet this bulk density requirement, foam production methods are generally used, but the strength of silica bricks produced by this production method cannot meet the requirements. Easy to collapse, easy to crack during firing, directly affect product molding and quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] In terms of weight percentage, 89% of silica sand powder, 2% of silica micropowder, 1% of lime plaster powder, 2% of high-temperature binder and 6% of sawdust are used as raw materials.

Embodiment 2

[0015] In terms of weight percentage, 90% of silica sand powder, 3% of silica micropowder, 2% of lime plaster powder, 3% of high-temperature binder and 2% of sawdust are used as raw materials.

Embodiment 3

[0017] In terms of weight percentage, 88% of silica sand powder, 3% of silica micropowder, 1% of lime paste powder, 5% of high-temperature binder and 3% of sawdust are used as raw materials.

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PUM

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Abstract

The invention discloses a low heat conduction light heat insulating silica brick, comprising the following components by weight percent: 88-91% of silica flour, 2-6% of silica micro powder, 1-3% of lime putty powder and 2-5% of high temperature binding agent as well as 2-6% of sawdust. The silica brick produced according to the formula has the advantages of small volume weight, low heat conductivity factor and high strength.

Description

technical field [0001] The utility model relates to the field of refractory building materials, in particular to a low-heat-conducting light-weight heat-preserving silica brick. Background technique [0002] The traditional lightweight silica bricks have the following disadvantages: first, the volume is large, generally greater than 1.0; second, the apparent porosity is relatively high, which makes the thermal conductivity higher than 0.5, and the silica bricks are easy to burst when used. In practical applications, the bulk density of silica bricks should be less than 0.6, which is the best. To meet this bulk density requirement, foam production methods are generally used, but the strength of silica bricks produced by this production method cannot meet the requirements. It is easy to collapse and crack during firing, which directly affects the molding and quality of the product. Contents of the invention [0003] The problem to be solved by the present invention is to pr...

Claims

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Application Information

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IPC IPC(8): E04C1/00C04B14/06
Inventor 施富贤
Owner 施富贤
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