Low heat conduction light heat insulating silica brick
A low thermal conductivity, lightweight technology, applied in building components, buildings, building structures, etc., can solve the problems of high thermal conductivity, easy to collapse, easy to crack during firing, etc., to reduce thermal conductivity, improve brick strength, thermal insulation performance Good results
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Example Embodiment
[0012] Example 1
[0013] In terms of weight percentage, 89% silica sand powder, 2% silica powder, 1% lime paste powder, 2% high-temperature binder and 6% sawdust are mixed as raw materials.
Example Embodiment
[0014] Example 2
[0015] In terms of weight percentage, 90% silica sand powder, 3% silica powder, 2% lime paste powder, 3% high-temperature binder and 2% sawdust are mixed as raw materials.
Example Embodiment
[0016] Example 3
[0017] In terms of weight percentage, 88% silica sand powder, 3% silica powder, 1% lime paste powder, 5% high temperature binder and 3% sawdust are mixed as raw materials.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap