Heterogeneous material bonding method

Abstract

The invention relates to a heterogeneous material bonding method which comprises the following steps of: first, processing base material by sand blast; then, leading a first metal lead and a second metal lead to be respectively and electrically connected with a power supply for providing different electrical properties for the first metal lead and the second metal lead; after that, generating electric arc according to the different electrical properties for the first metal lead and the second metal lead; using the electric arc to heat the first metal lead and the second metal lead for smelting the first metal lead and the second metal lead to form a molten material; and using compressed air to jet the molten material for blowing away a plurality of particles and whiffing the particles onto the base material, and forming a spray coating layer on the base material; wherein the molten material has rapid cooling effect after being blown away by cyclone flow field formed by the compressed air and forming the plurality of particles, so that the aim of bonding copper and aluminium at the low temperature can be achieved.

Description

technical field [0001] The present invention relates to a bonding method, in particular to a bonding method of heterogeneous materials which bonds heterogeneous materials to each other at low temperature. Background technique [0002] Due to the development of electronic technology and the progress of the integrated circuit (integrate circuit) process (ie, the process, which is referred to as the process in this article), the number of transistors contained in each chip (chip) is increasing, but the chip (ie, chip) , which are referred to as chips in this article) are getting smaller and smaller, making thermal dissipation a problem to be overcome in current electronic technology. [0003] The current heat dissipation method for electronic components is achieved by using a heat dissipation module (that is, a module, which is referred to as a module in this article) (thermal module). The metal material of the heat dissipation module can quickly transfer heat to the electronic...

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to overcome the defects existing in the existing heterogeneous material bonding method, and provide a new heterogeneous material bonding method, the technical problem to be solved is to make it solve the existing known technology High-quality materials, such as the high cost of bonding copper and aluminum, or the problem of easily generating moisture and damaging electronic components during high-temperature operation, are very suitable for practical use.

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