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Mixed small-channel cooler

A thin channel and cooler technology, which is applied in cooling/ventilation/heating transformation, instruments, semiconductor devices, etc., can solve the problems of not conforming to electronic products, large heat dissipation devices, etc., and achieve compact structure, good heat dissipation effect, and enhanced heat dissipation effect of effect

Inactive Publication Date: 2010-07-28
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now the most common heat dissipation method is an aluminum sheet heat sink, which uses forced air cooling for heat dissipation, but traditional radiators and fans are increasingly unable to meet the development needs of electronic products, and the heat sink is large in size, which does not meet the requirements of electronic products. The development direction of precision and compactness, so it is necessary to design a new type of cooling device

Method used

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Embodiment Construction

[0036] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0037] Such as figure 1 As shown, the hybrid thin-channel cooler is composed of a base 1 and a channel 2, and a set of check valves are arranged inside the channel 2, and cooling fins 3 are evenly arranged outside the channel 2. The fluid flow direction between the heat sink 3 and the contact position is greater than 0 degrees and less than or equal to 90 degrees.

[0038] Such as figure 2 Shown, passage 2 comprises two vertical passages and cross passage A8, cross passage B9, and cross passage B9 is at the top of two vertical passages, and cross passage A8 is in the middle of two vertical passages, and between cross passage A8 and two vertical passages The upper and lower sides of the channel connection are respectively provided with one-way valve I4, one-way valve II5, one-way valve III6 and one-way valve IV7, wherein one-way valve I4, one-way valv...

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Abstract

The invention relates to a mixed small-channel cooler which not only overcomes the defects in the structure and the performance of the common radiating device, but also meets the demands of economic benefit, environmental friendliness and high efficiency. The structure of the mixed small-channel cooler is as follows: the mixed small-channel cooler comprises a base body, plural channels are connected to the base body, and heat-conductive media is filled in the base body and the channels; meanwhile, a one-way break-over device is arranged inside each channel, so that a heat-conductive media flow loop is formed in each channel; and plural radiating fins are evenly arranged at the outer parts of the channels.

Description

technical field [0001] The invention relates to a thin-channel cooler for cooling electronic products, in particular to a hybrid thin-channel cooler for electronic components. Background technique [0002] With the development of the electronic information industry, the integration of electronic products is gradually increasing, and high-tech electronic products are developing in the direction of small size and fast calculation. Therefore, the heat generation of electronic products continues to increase, which affects the stability and operation performance of the products. The performance of heat dissipation products and the quality of heat dissipation directly affect the life and performance of electronic products. Now the most common heat dissipation method is an aluminum sheet heat sink, which uses forced air cooling for heat dissipation, but traditional radiators and fans are increasingly unable to meet the development needs of electronic products, and the heat sink is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/373H01L23/367H05K7/20G06F1/20
Inventor 张树生陈雅群郭雷
Owner SHANDONG UNIV
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