Method for preparing medium bridge by using polyimide

A technology of polyimide and cloth polyimide is applied in the field of using polyimide to make dielectric bridges, which can solve the problems of easy cracking of bridge decks, and achieve high reliability, simple process steps, and controllable processes. effect of steps
CN101800191AActive Publication Date: 2010-08-11INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Publication Date
2010-08-11

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Abstract

The invention discloses a method for preparing a medium bridge by using polyimide. The method comprises the following steps: coating a photoresist on a substrate and performing photo-etching to obtain a bridge deck; evaporating and stripping metal to form the bridge deck; coating the photoresist on the substrate and performing photo-etching to obtain a bridge pier; evaporating and stripping the metal to form the bridge pier; coating the polyimide on the substrate and solidifying the coated polyimide at a high temperature; etching residual polyimide by dry etching until the bridge pier is exposed; coating the photoresist on the polyimide and performing photo-etching to obtain a bridge pier lead; and evaporating and stripping the metal to form the bridge pier lead. The medium bridge prepared by the method takes the polyimide as a medium, and the bridge deck length of the medium bridge is not limited on the aspect of maximum span compared with a conventional air bridge, so the problem that the bridge deck in traditional air bridge process is easy to break is solved.
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Description

technical field

[0001] The invention relates to the technical field of manufacturing technology of semiconductor devices and integrated circuits, in particular to a method for making a dielectric bridge by using polyimide. Background technique

[0002] In semiconductor devices and integrated circuits, it is often necessary to use an air bridge structure at the intersection of two wirings to realize the cross-connection of two layers of metal. The air bridge can be prepared by evaporating metal or electroplating metal, but the process is complicated and requires multiple photolithography.

[0003] At present, there are three common methods for making air bridges. One is to use composite glue electroplating to make air bridges, the other is to use photoresist to transfer the required graphics to the sacrificial layer to make air bridges, and the third is to use photosensitive adhesive layer to make air bridges. . The air bridge made by these three methods, the final shape of...

Claims

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