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40results about How to "Breakage" patented technology

Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus

The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency.
Owner:SHIN ETSU CHEM IND CO LTD

Refrigerator

A refrigerator using shelves that can be arranged in the front-rear direction to enhance receiving efficiency of a receiving room and where a mechanism for preventing falling off of the shelves is realized by a very simple structure. The refrigerator includes a shelf engagement mechanism (X1) having a first fixation member (51) and second fixation member (52) that are provided at either a front shelf (4)or a rear shelf (3) and the other and are engaged with each other, the front and rear shelves (4, 3) having glass plates (41, 31) as constituent elements. The first fixation member (51) has a recess (51b) oriented in substantially the horizontal direction and also has a first engagement section (51c) and second engagement section (51d) that are projectingly formed on the upper surface and lower surface, respectively, inside the recess (51b). The second fixation member (52) has a projection (52b) oriented in substantially the horizontal direction and inserted into the recess (51b) of the first fixation member and also has a third engagement section (52c) projectingly formed on either the upper surface or lower surface of the projection (52b). Depending on the orientation of the front side and rear side of each of the two shelves, either the first engagement section (51c) or the second engagement section (51d) and the third engagement section (52c) of the projection (52b) inserted in the recess (51b) are engaged with each other.
Owner:SHARP KK

Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus

The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency.
Owner:SHIN ETSU CHEM IND CO LTD

Refrigerator

A refrigerator using shelves that can be arranged in the front-rear direction to enhance receiving efficiency of a receiving room and where a mechanism for preventing falling off of the shelves is realized by a very simple structure. The refrigerator includes a shelf engagement mechanism (X1) having a first fixation member (51) and second fixation member (52) that are provided at either a front shelf (4)or a rear shelf (3) and the other and are engaged with each other, the front and rear shelves (4, 3) having glass plates (41, 31) as constituent elements. The first fixation member (51) has a recess (51b) oriented in substantially the horizontal direction and also has a first engagement section (51c) and second engagement section (51d) that are projectingly formed on the upper surface and lower surface, respectively, inside the recess (51b). The second fixation member (52) has a projection (52b) oriented in substantially the horizontal direction and inserted into the recess (51b) of the first fixation member and also has a third engagement section (52c) projectingly formed on either the upper surface or lower surface of the projection (52b). Depending on the orientation of the front side and rear side of each of the two shelves, either the first engagement section (51c) or the second engagement section (51d) and the third engagement section (52c) of the projection (52b) inserted in the recess (51b) are engaged with each other.
Owner:SHARP KK
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