Low volatile and thermostable phenolic resin and fabrication method thereof
A phenolic resin, low volatility technology, used in non-polymer adhesive additives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of high volatile content and high temperature resistant phenolic resins problems such as low temperature, to achieve the effect of improving bonding strength and reducing air bubbles
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specific Embodiment approach 1
[0007] Embodiment 1: A low-volatility high-temperature-resistant phenolic resin in this embodiment is made of phenolic resin, aluminum dihydrogen phosphate powder, nano-scale alumina and magnesium oxide, wherein the phenolic resin: the mass of aluminum dihydrogen phosphate powder The ratio is 100:18~22, the mass ratio of phenolic resin:nano-scale alumina is 100:18~22, the mass ratio of phenolic resin:magnesia is 100:8~12, and the phenolic resin is made of phenol with a mass concentration of 35% to 37% formaldehyde and zinc oxide are made according to the mass ratio of phenol: formaldehyde with a mass concentration of 35% to 37% is 100:90 to 110, and the mass ratio of phenol to zinc oxide is 100:1.8 to 2.2.
[0008] This embodiment uses aluminum dihydrogen phosphate powder, nano-sized alumina as a curing agent, and magnesium oxide as a curing accelerator to prepare a low-volatility high-temperature-resistant phenolic resin. The method tests that the volatile matter content in t...
specific Embodiment approach 2
[0009] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the mass ratio of phenolic resin: aluminum dihydrogen phosphate powder in the low-volatility high-temperature-resistant phenolic resin is 100:19-21, and the phenolic resin: nano-scale alumina The mass ratio of phenolic resin: magnesium oxide is 100:19-21, and the mass ratio of phenolic resin: magnesium oxide is 100:9-11. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0010] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the mass ratio of phenolic resin: aluminum dihydrogen phosphate powder in low volatility high temperature phenolic resin is 100:20, phenolic resin: nano-scale alumina The mass ratio of phenolic resin: magnesium oxide is 100:20, and the mass ratio of phenolic resin: magnesium oxide is 100:10. Others are the same as in the first or second embodiment.
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Abstract
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