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Low volatile and thermostable phenolic resin and fabrication method thereof

A phenolic resin, low volatility technology, used in non-polymer adhesive additives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of high volatile content and high temperature resistant phenolic resins problems such as low temperature, to achieve the effect of improving bonding strength and reducing air bubbles

Inactive Publication Date: 2011-08-24
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-volatility high-temperature-resistant phenolic resin and its preparation method in order to solve the problems of low operating temperature and high volatile content in the curing process of the existing high-temperature-resistant phenolic resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0007] Embodiment 1: A low-volatility high-temperature-resistant phenolic resin in this embodiment is made of phenolic resin, aluminum dihydrogen phosphate powder, nano-scale alumina and magnesium oxide, wherein the phenolic resin: the mass of aluminum dihydrogen phosphate powder The ratio is 100:18~22, the mass ratio of phenolic resin:nano-scale alumina is 100:18~22, the mass ratio of phenolic resin:magnesia is 100:8~12, and the phenolic resin is made of phenol with a mass concentration of 35% to 37% formaldehyde and zinc oxide are made according to the mass ratio of phenol: formaldehyde with a mass concentration of 35% to 37% is 100:90 to 110, and the mass ratio of phenol to zinc oxide is 100:1.8 to 2.2.

[0008] This embodiment uses aluminum dihydrogen phosphate powder, nano-sized alumina as a curing agent, and magnesium oxide as a curing accelerator to prepare a low-volatility high-temperature-resistant phenolic resin. The method tests that the volatile matter content in t...

specific Embodiment approach 2

[0009] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the mass ratio of phenolic resin: aluminum dihydrogen phosphate powder in the low-volatility high-temperature-resistant phenolic resin is 100:19-21, and the phenolic resin: nano-scale alumina The mass ratio of phenolic resin: magnesium oxide is 100:19-21, and the mass ratio of phenolic resin: magnesium oxide is 100:9-11. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0010] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the mass ratio of phenolic resin: aluminum dihydrogen phosphate powder in low volatility high temperature phenolic resin is 100:20, phenolic resin: nano-scale alumina The mass ratio of phenolic resin: magnesium oxide is 100:20, and the mass ratio of phenolic resin: magnesium oxide is 100:10. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a low volatile and thermostable phenolic resin and a fabrication method thereof. In the invention, problems of low operating temperature and the high volatile contents during the process of sodification in the existing thermostable phenolic resin are solved. The low volatile and thermostable phenolic resin is produced by a phenolic resin, aluminum dihydrogen phosphate powder, nano-alumina and magnesium oxide. The method comprises the following steps: firstly using zinc oxide as catalyst to product the phenolic resin, and then evenly mixing the phenolic resin, aluminumdihydrogen phosphate powder, nano-alumina and magnesium oxide to obtain the low volatile and thermostable phenolic resin. The volatile contents of the resin of the invention range from 0.7 percent to1.0 percent in the solidification process. The shear strength of the adhesive specimen is 10 MPa to 11 MPa under room temperature, and 1.4 MPa to 1.6Mpa under the temperature of 800 DEG C. The operating temperature reaches 800 DEG C by adoption of the invention. The resin produced by the invention can be applied to the fields of adhesives and coating.

Description

technical field [0001] The invention relates to a high temperature resistant phenolic resin and a preparation method thereof. Background technique [0002] Thermosetting phenolic resins prepared with alkaline substances as catalysts, especially phenolic resins with zinc oxide as catalysts, have good comprehensive properties and are widely used in the fields of adhesives and coatings. However, when the phenolic resin with zinc oxide as a catalyst is used as an adhesive, its working temperature is low. Bismaleimide, silicone resin, molybdic acid and boric acid are often used to modify this resin in order to improve its heat resistance. The maximum use temperature of the high-temperature resistant phenolic resin obtained after curing is ≤350°C, the working temperature is low, and the volatile content of these high-temperature resistant phenolic resins is as high as 6% to 7% during the curing process, which limits its use. Contents of the invention [0003] The object of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/10C08K3/32C08K3/22C08G8/10C09D161/10C09D7/12C09D5/18C09J161/10C09J11/04
Inventor 黄伣丽王超陈泽明
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI