Module socket

Abstract

The invention relates to a module socket. A baffle (4) is erected at a pair of edges of a protective bottom (41) and is provided with a protective sidewall part (42), a housing (2) is erected at a pair of edges of a rectangle bottom (21) and is provided with a housing sidewall part (22), the baffle (4) and the housing (2) are assembled to make a frame structure with an opening at the upper portion. an upper housing plate (3) is fastened at the front side of the housing sidewall part (22), and a module contact part (34) fastened with the module and grounded is arranged at the inner side of the frame structure. Moreover, and a module contact part (45) fastened with the module and grounded is arranged at the inner side of the frame structure of the baffle (4). The module socket has reduced through hole, increased design free degree for the print distribution circuit board and reduced installation size.

Description

technical field [0001] The present invention relates to a module socket used for mounting a module such as a camera used in an electronic device in the electronic device. Background technique [0002] Modules mounted on electronic devices such as printed circuit boards are, for example, camera modules incorporating imaging elements. As electronic devices such as mobile phones are miniaturized, camera modules are also required to be miniaturized. Of course, a camera module has also been developed, which has a high imaging function and is compact. [0003] However, in order to achieve high functionality, the camera module must be as compact as possible and have functions such as a low-magnification camera function. In addition, simplification and cost reduction of the manufacturing process are required. [0004] Therefore, in order to mount a camera module on an electronic device, etc., it is desired to reduce the size of the socket as much as possible, reduce the number of ...

AI Technical Summary

Problems solved by technology

[0020] In this way, since the thickness of the surrounding wall part of the resin molding is necessary, the outer side of the raised bottom part is covered with the protective cover 140 formed by metal plate molding, and the protective cover 140 is formed except for the thickness of the peripheral wall part. The thickness of the metal plate is required, and there is a problem that the overall shape becomes larger

In particular, in the through-hole mounting type modular jack, the through-hole TH penetrating the printed wiring board becomes large, and there is a problem that the design of the printed wiring board increases and the degree of freedom decreases.

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