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Lamination lay-up system and transfer machine thereof

A transfer machine and stacking technology, applied in the direction of lamination, lamination device, layered products, etc., can solve the problems of high labor intensity, inaccurate alignment, low efficiency, etc., reducing labor intensity and improving production efficiency. , the effect of high labor intensity

Active Publication Date: 2010-08-18
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of the top cover of the jig also causes new technical problems, such as the inconvenient storage of the laminated cover, the grasping and alignment mainly rely on manual alignment, which is labor-intensive, the alignment is not accurate, and the storage position of the cover is occupied Large space, low efficiency

Method used

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  • Lamination lay-up system and transfer machine thereof
  • Lamination lay-up system and transfer machine thereof
  • Lamination lay-up system and transfer machine thereof

Examples

Experimental program
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Embodiment Construction

[0040] refer together Figure 1 to Figure 11 , the embodiment of the laminated board system of the present invention includes a press 10, a board feeding table 20 ( Figure 7 , Figure 8 , Figure 9 ), pallet 30 ( Figure 10 , Figure 11 ), storage station 40 ( Figure 5 , Figure 6 ) and transfer machine 50 ( image 3 , Figure 4 );

[0041] refer to figure 1 and figure 2 , the pallet inlet 20 is set adjacent to the feed port of the press 10, and the pallet discharge 30 is set adjacent to the discharge port of the press 10;

[0042] The storage platform 40 is located between the inlet platform 20 and the outlet platform 30;

[0043] The transfer machine 50 includes:

[0044] A pick-and-place device 51 for picking and placing pallet covers between the pallet entry platform 20, the storage platform 40 and the pallet output platform 30;

[0045] A driving device (not shown) that drives the pick-and-place device 51 to move at a fixed point between the pallet entry p...

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Abstract

The invention discloses a lamination lay-up system and a transfer machine thereof. The lamination system comprises a press, a plate feeding table, a plate discharging table, a storage table and the transfer machine, wherein the storage table is positioned between the plate feeding table and the plate discharging table. The transfer machine comprises a catch and release device, a driving device, a plate feeding induction device, a plate discharging induction system and a control device, wherein the catch and release device is used for catching and releasing trays and cover plates at a fixed point above the plate feeding table, the storage table and the plate discharging table; the driving device is used for driving the catch and release device to move in the fixed point above the plate feeding table, the storage table and the plate discharging table; the plate feeding induction device is positioned on the plate feeding table and inducts whether plates reach a position where the cover plates are needed or not; the plate discharging induction device is positioned on the plate discharging table and inducts whether the cover plates on the plates are in place or not; and the control device is connected with the plate feeding induction device, the plate discharging induction device, the catch and release device and the driving device. By adopting the invention, the cover plates can be processed with high efficiency, full automation and high precision.

Description

technical field [0001] The invention relates to the field of mechanical manufacturing equipment, in particular to a lamination stack system. Background technique [0002] With the miniaturization of electronic products, various electronic components are also developing in the direction of miniaturization and miniaturization. The development trend of high-density flexible printed circuit boards will inevitably put forward stricter requirements on the alignment accuracy (lamination deviation) of the cover film and the amount of glue overflow on the cover film. [0003] In the prior art, the method of laminating the covering film using a jig includes the following steps: [0004] 1. Cover membrane preparation. Positioning holes are made on the copper foil after the circuit pattern is completed, and small holes are also made on the cover film corresponding to the positions of these positioning holes. It is also necessary to make a bonding positioning jig, and the position of t...

Claims

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Application Information

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IPC IPC(8): H05K3/00B65G61/00B32B37/10
Inventor 韩力陈念明黄胜贤肖海清
Owner SHENNAN CIRCUITS
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