Magnetron sputtering plating film cathode device
A magnetron sputtering coating and cathode technology, which is applied in sputtering coating, ion implantation coating, vacuum evaporation coating, etc., can solve the problems of large changes in the magnetic field strength of the magnetic bar, uneven film thickness, and uneven magnetic field. , to achieve the effects of small temperature difference, improved coating uniformity, and uniform cooling effect
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[0018] The structure of the magnetron sputtering coating cathode device (hereinafter referred to as the rotating cathode) is mainly described below with reference to the drawings. By uniformly cooling the sputtering area, there is no temperature difference between the two ends of the target, the magnetic field is stable during the sputtering process, and the coating thickness can be uniform.
[0019] 1 is a cross-sectional view of a magnetron sputtering coating cathode device. The magnetron sputtering coating cathode device includes a target barrel 10 and a magnet rod tube 20. The target barrel 10 has a cylindrical structure and includes a sputtering target 110 and a target inner barrel 120. The sputtering target 110 uniformly covers the target inner barrel 120 and forms a whole with the target inner barrel 120.
[0020] The magnetic rod tube 20 is located in the target barrel 10, and a magnet 210 is installed inside the magnetic rod tube 20 and a cooling water channel 220 is provi...
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