Ultrasonic processing method for enhancing size accuracy of micro-electroformed apparatus

Abstract

The invention relates to an ultrasonic processing method for enhancing the size accuracy of a micro-electroformed apparatus, belongs to the technical field of micro-manufacturing and particularly relates to a method for enhancing the size accuracy of the micro-electroformed apparatus. A process for manufacturing the micro-electroformed apparatus comprises the following processes: performing pretreatment on a nickel substrate, manufacturing a micro-electroformed rubber mold and performing micro-electroforming. In the process of manufacturing the micro-electroformed rubber mold, the nickel substrate coated with SU-8 rubber is fixed on an ultrasonic workbench after whirl coating, prebaking, photo-etching and after-baking are performed, is ultrasonically vibrated and developed to obtain the micro-electroformed rubber mold. The micro-electroformed rubber mold is soaked into electrotyping solution and is subjected to electro-deposition in a groove of the micro-electroformed rubber mold to form a nickel-electroformed layer. The SU-8 rubber is removed and vacuum annealing treatment is performed to eliminate residual stress. Due to the adoption of the method, the amount of the electrotyping solution absorbed by the SU-8 rubber in the electroforming process is reduced, swelling of the rubber mold is lowered and the size accuracy of the micro-electroformed apparatus is enhanced.

Description

An Ultrasonic Treatment Method for Improving Dimensional Accuracy of Micro-Electroformed Devices technical field The invention belongs to the field of micro-manufacturing technology, in particular to a method for improving the dimensional accuracy of micro-electroforming devices. Background technique The micro-electroforming technology based on the UV-LIGA process of SU-8 glue has been widely used in the manufacturing of micro-devices such as micro-sensors, micro-actuators and micro-molds. During the micro-electroforming process, the SU-8 glue will absorb the electroforming liquid, causing the volume of the plastic mold to expand and produce a swelling effect. The difference between the metal structure and the designed size after electroforming can even reach 50%. The swelling of the photoresist mold seriously affects the controllability and accuracy of the structure size of the electroformed device. In order to reduce the error caused by PMMA colloidal swelling during el...

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Problems solved by technology

In the Journal of Micromechanics and Microengineering 2004, No. 14, pages 1548-1557, a scheme of adding an isolation zone around the rubber mold pattern is proposed to reduce the influence of the swelling of the surrounding large-area PMMA colloid on the electroforming structure. This method only affects the periphery Structurally efficient, does not work for middle parts of dense, complex graphs

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