Preparation method of solvent compound adhesive

A composite adhesive, solvent-based technology, applied in the direction of adhesive types, polyurea/polyurethane adhesives, polymer adhesive additives, etc., can solve problems such as health and safety hazards, and achieve low solvent residue and release good sex effect

Inactive Publication Date: 2010-09-01
BEIJING COMENS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are certain health and sa

Method used

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Examples

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preparation example Construction

[0029] The embodiment of the present invention provides a method for preparing a solvent-based composite adhesive, which can produce a low-residue solvent-based composite adhesive, which can meet the needs of composite materials with low solvent residue and high safety. Preparation methods include:

[0030] Prepare main agent, each raw material consumption is by mass percentage in this step:

[0031] In the reaction kettle, heat 40-45% polyether polyol by mass percentage to 110°C, vacuumize, fill with nitrogen, dehydrate for 2 hours, cool down, add 10-30% by mass percentage of diisocyanate at 80 React at ℃~90℃ for 4 hours; after the reaction is over, take a sample to measure the NCO mass percentage and viscosity of the reaction product to confirm whether the reaction is qualified; if the reaction is qualified, add 25 to 50% by mass percentage to the reaction product Adjust the solid content with ethyl acetate, cool down and discharge to obtain the main agent of the adhesive; ...

Embodiment 1

[0046] This embodiment provides a method for preparing a solvent-based composite adhesive, which can produce a low-residue solvent-based composite adhesive. The method includes the following steps:

[0047] Prepare the main ingredient:

[0048] Put 100kg of polyether polyol with a molecular weight of 400 into the reactor, raise the temperature to 110°C, vacuumize, fill with nitrogen, dehydrate for 2h, cool down, then add 66kg of toluene diisocyanate and react at 80°C for 4h; after the reaction is over, take a sample The mass percentage and viscosity of NCO in the reaction product were measured. If the NCO% content of the reaction product is 1.5-3%, and the viscosity is 4000-7000mPa.s, the reaction is qualified; if the reaction is qualified, add 58kg of ethyl acetate to the reaction product to adjust the solid content, cool down and discharge, and obtain The reaction product is the main agent of the adhesive;

[0049] Prepare curing agent:

[0050] Preparation of esterified ...

Embodiment 2

[0058] This embodiment provides a method for preparing a solvent-based composite adhesive, which can produce a low-residue solvent-based composite adhesive. The method includes the following steps:

[0059] Prepare the main ingredient:

[0060] Put 175kg of polyether polyol with a molecular weight of 700 into the reaction kettle, raise the temperature to 110°C, vacuumize, fill with nitrogen, dehydrate for 2h, cool down, then add 88kg of diphenylmethane-4,4'-diisocyanate, in React at 80°C for 4 hours; after the reaction is over, take a sample to measure the mass percentage of NCO and viscosity. If the NCO% content of the reaction product is 1.5-3%, and the viscosity is 4000-7000mPa.s, the reaction is qualified; if the reaction is qualified, add 174kg of ethyl acetate to the reaction product to adjust the solid content, cool down and discharge, and obtain The reaction product of the adhesive is used as the main agent of the adhesive;

[0061] Prepare curing agent:

[0062] Pr...

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Abstract

The invention discloses a solvent compound adhesive and a preparation method thereof. The preparation method comprises the following steps: taking polyether glycol, diisocyanate, polyalcohol, dicarboxylic acid, epoxy resin and ethyl acetate with molecular weight of 400-1000 as raw materials; preparing a main agent and a curing agent; and then mixing the obtained main agent and the curing agent proportionally to obtain the double-component solvent compound adhesive. The adhesive has good bonding strength, low solvent residual quantity, high safety and environmental protection, thus solving the problem of high residual quantity of the solvent adhesive in winter.

Description

technical field [0001] The invention relates to the field of composite adhesives, in particular to a method for preparing a low-residue solvent-based composite adhesive. Background technique [0002] The food packaged and protected by the food packaging composite film is the food that people eat directly. In order to be responsible for the health and safety of consumers, not only the base film must be tasteless, odorless and non-toxic, but also the adhesive used should have the same performance. , Safety and health is a major issue that countries all over the world attach great importance to. The hygienic and safe performance of solvent-based polyurethane adhesives is mainly due to solvent residues. There are certain health and safety hazards in the application. Especially when the temperature is low in winter, the problem of solvent residue is more serious. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a method...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J11/08
Inventor 张淑萍沈峰
Owner BEIJING COMENS NEW MATERIALS
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