Chip-suspension-type packaging heat dissipation improved structure of semiconductor

Abstract

The invention relates to a chip-suspension-type packaging heat dissipation improved structure of a semiconductor, which comprises a chip, metal leads, a bonding material, a lead frame and a plastic package material, and also comprises a spring heat dissipater, wherein transmission pins are arranged on the lead frame, and the chip is arranged on the transmission pins through the bonding material and is in electrical interconnection with the lead frame through the metal leads; the spring heat dissipater, the chip, the metal leads, the bonding material and the lead frame are plastic-packaged bythe plastic package material to form a plastic package body, and the periphery of the spring heat dissipater is fixed by the plastic package material; and one end of the spring heat dissipater is connected with the chip, and the other end thereof is exposed to the surface of the plastic package body to dissipate the heat of the chip out of the plastic package body, thereby solving the heat dissipation difficulties that no exposed chip bears a base or a flip chip is packaged, and greatly improving the electrothermal performance and reliability of products.

Description

technical field [0001] The invention relates to a heat dissipation structure in the technical field of semiconductor packaging, in particular to an improved heat dissipation structure of a chip suspension type semiconductor packaging. Background technique [0002] The traditional chip suspension semiconductor package structure mostly uses lead frames to dissipate heat, which mainly has the following shortcomings: [0003] 1. In the traditional chip suspension semiconductor packaging structure, the chip is suspended on the lead frame, and it is difficult for the suspended chip to dissipate heat sufficiently, which in turn affects the electrothermal performance and reliability of the final product. [0004] 2. In the traditional semiconductor lead frame package, most of the heat generated by the chip is conducted through the metal carrier plate in the package body. In order to meet the high heat dissipation requirements, the area of ​​the carrier plate is increased. On the one...

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Problems solved by technology

[0003] 1. In the traditional chip suspension semiconductor packaging structure, the chip is suspended on the lead frame, and it is difficult for the suspended chip to dissipate heat sufficiently, which in turn affects the electrothermal performance and reliability of the final product

[0004] 2. In the traditional semiconductor lead frame package, most of the heat generated by the chip is conducted through the metal carrier plate in the package body. In order to meet the high heat dissipation requirements, the area of ​​the carrier plate is increased. On the one hand, it will be affected by the difference in thermal expansion rate between different materials. It is easy to cause reliability problems such as stress residue and delamination; on the other hand, it does not meet the development requirements of the trend of semiconductor packages becoming thinner and smaller

[0005] 3. In the traditional semiconductor packaging structure, the heat dissipation effect is also improved by using high thermal conductivity plastic sealing compound. In addition to the high cost price of high thermal conductivity plastic sealing compound, it also puts forward higher requirements for the control of product plastic packaging process, and The heat dissipation effect is not obvious

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