2results about How to "Improve electrothermal performance" patented technology

The application provides a circuit board and a manufacturing method thereof. A medium layer source, i.e., a resin source, is divided into multiple parts, i.e., a top medium layer above a buried device and an intermediate medium layer between core boards. In a pressing process, the top medium layer above the buried device fills a gap between an upper frame (a second core board) and the buried device, and the intermediate medium layer between the core boards quickly fills a gap between a lower frame (a first core board) and the buried device. The vertical distance of resin flow is greatly reduced, the resin flowability is greatly improved, the problem of insufficient filling caused by insufficient resin flowability or mismatched curing speed can be effectively avoided, the problem of insufficient glue filling capacity of a traditional single-frame design when processing a large-thickness component is solved, and the reliability and stability of the buried device are improved.

The application provides a flexible electrothermal film based on a sliding microsheet and an electrothermal performance evaluation method thereof; the flexible electrothermal film is composed of reduced graphene oxide, a polymer matrix and a sliding microsheet dispersed in the matrix; the sliding microsheet has a low interfacial friction coefficient and can generate a sliding displacement of 0.1-5 microns in the in-plane direction of the film under the action of bending, thereby improving the conductive connectivity between the reduced graphene oxide layers, realizing the force-triggered reconstruction of the conductive network and keeping or improving the electrothermal performance of the film under different bending angles. The application further provides an electrothermal performance coupling evaluation method for characterizing the relationship between the bending angle, the content of the sliding microsheet and the resistance response, so as to quantify the electrothermal behavior of the flexible electrothermal film under different use conditions. The application has a significant advantage in the structural design and performance prediction of flexible electrothermal materials and is suitable for the fields of aviation electrothermal deicing, intelligent wearing and flexible heating devices.