6results about How to "Improve electrothermal performance" patented technology

The invention relates to the technical field of semiconductor packaging, in particular to an improved fan-out wafer level packaging process applied to a high-performance W wave band, which comprises the following steps of: forming a first surface supporting carrier plate, and laying a double-sided adhesive film on the first surface supporting carrier plate to provide support for subsequent chip fixation; forming a cavity between the chip area and the medium area, and forming an electroplating area at a required position to prevent the air bridge structure from collapsing; the chip is fixed on the supporting carrier plate through a flip chip; the chip is fixed by using a film pressing technology, so that the stability of the chip in a subsequent process is ensured; a cavity is formed between a chip area and a dielectric area, so that collapse of an air bridge structure is prevented, structural stability is improved, intrinsic performance deterioration of the transistor is prevented, dielectric is not attached to the surface of an active area, intrinsic performance deterioration of the transistor is prevented, and stable performance of a device is ensured. And electrical connection of the upper and lower parts of the package is realized through a glass perforation technology, so that the electric heating performance is improved.

The invention provides a wood-based hydrophobic low-voltage electric heating composite material and a preparation method thereof. The wood-based hydrophobic low-voltage electric heating composite material with an ultra-low-voltage electric heating effect, super-hydrophobicity and high heat-conducting property is obtained through a multi-element synergistic effect. Loading nano nickel oxide on the surface of the delignification wood, and graphitizing under oxidation catalysis of the nano nickel oxide to obtain conductive carbonized wood; performing etching treatment on Ti3AlC2 by using an etching solution prepared by mixing lithium fluoride and hydrochloric acid to obtain an etching mixture; centrifugally deacidifying the etching mixture, and collecting supernate to obtain an MXene suspension; adding graphene into the suspension, carrying out water bath ultrasonic dispersion and magnetic stirring, and drying to obtain an MXene loaded graphene mixture; adding the mixture into a perfluorooctyltrichlorosilane modified epoxy resin adhesive, then adding a curing agent, mixing, and defoaming to obtain an MXene / graphene-epoxy resin mixture; the conductive carbonized wood is pressurized, impregnated and cured by the mixture to obtain the wood-based hydrophobic low-voltage electric heating composite material.

The invention relates to the technical field of heating materials, in particular to a heating material for a PTC heating bag of a new energy automobile and a preparation process of the heating material. The preparation process comprises the following steps: preparing the magnetic liquid metal carbon nanotube; preparing a carbon nano tube composite hydrogel fiber; preparing a carbon nanotube composite nanofluid; and preparing the heating material for the PTC heating bag of the new energy automobile. The magnetic liquid metal carbon nanotube is prepared by compounding the carboxylated multi-walled carbon nanotube, the iron ions and the gallium-indium alloy, the gallium-indium alloy can be protected from being corroded and oxidized by the structure coated by the multi-walled carbon nanotube, and the magnetic performance of the material can be improved by mixed weaving of the ferrite particles and the multi-walled carbon nanotube, so that the material has the advantages of high conductivity, high temperature resistance and the like. Due to good electric heating performance caused by high conductivity, the prepared heating material for the PTC heating bag is excellent and stable in electric heating performance, durable in use and longer in service life.

The application provides a circuit board and a manufacturing method thereof. A medium layer source, i.e., a resin source, is divided into multiple parts, i.e., a top medium layer above a buried device and an intermediate medium layer between core boards. In a pressing process, the top medium layer above the buried device fills a gap between an upper frame (a second core board) and the buried device, and the intermediate medium layer between the core boards quickly fills a gap between a lower frame (a first core board) and the buried device. The vertical distance of resin flow is greatly reduced, the resin flowability is greatly improved, the problem of insufficient filling caused by insufficient resin flowability or mismatched curing speed can be effectively avoided, the problem of insufficient glue filling capacity of a traditional single-frame design when processing a large-thickness component is solved, and the reliability and stability of the buried device are improved.

The application provides a flexible electrothermal film based on a sliding microsheet and an electrothermal performance evaluation method thereof; the flexible electrothermal film is composed of reduced graphene oxide, a polymer matrix and a sliding microsheet dispersed in the matrix; the sliding microsheet has a low interfacial friction coefficient and can generate a sliding displacement of 0.1-5 microns in the in-plane direction of the film under the action of bending, thereby improving the conductive connectivity between the reduced graphene oxide layers, realizing the force-triggered reconstruction of the conductive network and keeping or improving the electrothermal performance of the film under different bending angles. The application further provides an electrothermal performance coupling evaluation method for characterizing the relationship between the bending angle, the content of the sliding microsheet and the resistance response, so as to quantify the electrothermal behavior of the flexible electrothermal film under different use conditions. The application has a significant advantage in the structural design and performance prediction of flexible electrothermal materials and is suitable for the fields of aviation electrothermal deicing, intelligent wearing and flexible heating devices.

The invention relates to a Gunn diode with a diamond-graphene composite heat dissipation structure and a preparation method of the Gunn diode. The Gunn diode comprises a substrate layer; the buffer layer is located on the upper surface of the substrate layer; the channel layer is located on the upper surface of the buffer layer; the first cap layer is located on one side of the upper surface of the channel layer; the passivation layer is located on the upper surface of the channel layer, and one side of the passivation layer abuts against the first cap layer; the diamond heat dissipation layer is located on the upper surface of the passivation layer; the second cap layer is located on the side, away from the first cap layer, of the passivation layer; the cathode and the anode are respectively positioned on the upper surfaces of the first cap layer and the second cap layer; and the graphene layer covers the upper surfaces of the diamond heat dissipation layer, the anode and the channel layer. According to the method, heat accumulation in the Gunn diode can be greatly reduced, the heat dissipation performance is remarkably improved, the temperature generated in the working period is reduced, the probability that the working efficiency is reduced due to the heat effect is effectively reduced, and the service life of the Gunn diode is prolonged.