Flip-chip high-heat-radiation spheroidal array encapsulation structure

An array packaging, high heat dissipation technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems affecting the electrothermal performance and reliability of products, poor thermal conductivity of plastic substrates, poor heat dissipation semiconductor packaging, etc., to achieve stress absorption. The function is beneficial, the package structure is compact, and the effect of meeting the ultra-high heat dissipation requirements
CN101840896BActive Publication Date: 2014-03-05NANTONG FUJITSU MICROELECTRONICS
2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANTONG FUJITSU MICROELECTRONICS
Publication Date
2014-03-05

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a flip-chip high-heat-radiation spheroidal array encapsulation structure, which comprises a chip, an electric interconnection material, a lower filling material, a base plate, a plastic sealing material and a welding ball. A spring heat radiator is also arranged in the encapsulation structure. The electric interconnection material is planted on the front side of the chip, and is inversely arranged on the base plate, and the electric interconnection between the chip and the base plate is realized through the electric interconnection material, the lower filing material fills a gap between the chip and the base plate, the plastic sealing material plastically seals the spring heat radiator, the chip, the electric interconnection material, the lower filling material and the base plate for forming a plastic sealing body, the circumambience of the spring heat radiator is fixed by the plastic sealing material, one end of the spring heat radiator is connected with the chip, and the other end of the spring heat radiator is exposed on the surface of the plastic sealing body for radiating the heat of the chip out of the plastic sealing body. The problem of heat radiation of the encapsulation of carrying bases or inversely arranged chips without exposed metals is solved, and the electric heating performance and the reliability of the products are greatly improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a heat dissipation structure in the technical field of semiconductor packaging, in particular to a flip-chip soldering high heat dissipation ball array packaging structure. Background technique

[0002] The traditional semiconductor flip-chip packaging structure mostly dissipates heat through the substrate, which mainly has the following shortcomings:

[0003] 1. With the continuous development of semiconductor technology, there are more and more mid-to-high-end packages that use plastic substrate materials as the chip carrier base. In particular, ball array packages mostly use substrate materials. However, due to the poor thermal conductivity of the plastic substrate itself, heat dissipation not effectively.

[0004] 2. In the traditional flip-chip packaging structure, the chip is buckled upside down on the substrate through the electrical interconnection material, and it is difficult for the suspended chip to dissipate heat ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More