Flip-chip high-heat-radiation spheroidal array encapsulation structure

Abstract

The invention relates to a flip-chip high-heat-radiation spheroidal array encapsulation structure, which comprises a chip, an electric interconnection material, a lower filling material, a base plate, a plastic sealing material and a welding ball. A spring heat radiator is also arranged in the encapsulation structure. The electric interconnection material is planted on the front side of the chip, and is inversely arranged on the base plate, and the electric interconnection between the chip and the base plate is realized through the electric interconnection material, the lower filing material fills a gap between the chip and the base plate, the plastic sealing material plastically seals the spring heat radiator, the chip, the electric interconnection material, the lower filling material and the base plate for forming a plastic sealing body, the circumambience of the spring heat radiator is fixed by the plastic sealing material, one end of the spring heat radiator is connected with the chip, and the other end of the spring heat radiator is exposed on the surface of the plastic sealing body for radiating the heat of the chip out of the plastic sealing body. The problem of heat radiation of the encapsulation of carrying bases or inversely arranged chips without exposed metals is solved, and the electric heating performance and the reliability of the products are greatly improved.

Description

technical field [0001] The invention relates to a heat dissipation structure in the technical field of semiconductor packaging, in particular to a flip-chip soldering high heat dissipation ball array packaging structure. Background technique [0002] The traditional semiconductor flip-chip packaging structure mostly dissipates heat through the substrate, which mainly has the following shortcomings: [0003] 1. With the continuous development of semiconductor technology, there are more and more mid-to-high-end packages that use plastic substrate materials as the chip carrier base. In particular, ball array packages mostly use substrate materials. However, due to the poor thermal conductivity of the plastic substrate itself, heat dissipation not effectively. [0004] 2. In the traditional flip-chip packaging structure, the chip is buckled upside down on the substrate through the electrical interconnection material, and it is difficult for the suspended chip to dissipate heat ...

AI Technical Summary

Problems solved by technology

[0003] 1. With the continuous development of semiconductor technology, there are more and more mid-to-high-end packages that use plastic substrate materials as the chip carrier base. In particular, ball array packages mostly use substrate materials. However, due to the poor thermal conductivity of the plastic substrate itself, heat dissipation not effectively

[0004] 2. In the traditional flip-chip packaging structure, the chip is buckled upside down on the substrate through the electrical interconnection material, and it is difficult for the suspended chip to dissipate heat sufficiently. In addition, the heat dissipation effect of the substrate itself is not good. The traditional flip-chip structure Often the heat dissipation effect is poor, which in turn affects the electrothermal performance and reliability of the final product

[0005] 3. For semiconductor packages with poor heat dissipation due to the limitation of their own packaging structure, high thermal conductivity plastic packaging materials are also used to improve the heat dissipation effect. However, in addition to the high cost price of high thermal conductivity plastic packaging materials, the control of product packaging technology higher requirements, and the heat dissipation effect is not obvious

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