Improved method for semi-conductor flip-chip bonding package cooling

Abstract

The invention relates to an improved method for semi-conductor flip-chip bonding package cooling, which comprises the following steps that: a chip with electrical interconnecting material planted on the front side is arranged on a transmission tube pin of a lead frame upside down; a spring radiator is attached on the back side of the chip; plastic sealed material is used for sealing the spring radiator, the chip, the electrical interconnecting material and the lead frame to form a plastic sealed body, and the periphery of the spring radiator is fixed by the plastic sealed material; and one end of the spring radiator is connected with the chip and the other end thereof is exposed on the surface of the plastic sealed body so as to release the heat of the chip out of the plastic sealed body; and the improved method for semi-conductor flip-chip bonding package cooling solves the difficulty problem of cooling of some packages without exposed chip bearing base or flip chip, and greatly improves the electric heating performance and the reliability of the product.

Description

technical field [0001] The invention relates to a heat dissipation structure packaging method in the technical field of semiconductor packaging, in particular to a semiconductor flip-chip package heat dissipation manufacturing method. Background technique [0002] The traditional semiconductor chip flip-chip packaging structure mostly conducts chip heat through the carrier board, which mainly has the following shortcomings: [0003] 1. In the traditional semiconductor chip flip-chip packaging structure, the chip is suspended on the carrier board, and it is difficult for the suspended chip to dissipate heat sufficiently, which in turn affects the electrothermal performance and reliability of the final product. [0004] 2. In the traditional semiconductor lead frame package, most of the heat generated by the chip is conducted through the metal carrier plate in the package body. In order to meet the high heat dissipation requirements, the area of ​​the carrier plate is increase...

AI Technical Summary

Problems solved by technology

[0003] 1. In the traditional semiconductor chip flip-chip packaging structure, the chip is suspended on the carrier board, and it is difficult for the suspended chip to dissipate heat sufficiently, which in turn affects the electrothermal performance and reliability of the final product

[0004] 2. In the traditional semiconductor lead frame package, most of the heat generated by the chip is conducted through the metal carrier plate in the package body. In order to meet the high heat dissipation requirements, the area of ​​the carrier plate is increased. On the one hand, it will be affected by the difference in thermal expansion rate between different materials. It is easy to cause reliability problems such as stress residue and delamination; on the other hand, it does not meet the development requirements of the trend of semiconductor packages becoming thinner and smaller

[0005] 3. In the traditional semiconductor packaging structure, the heat dissipation effect is also improved by using high thermal conductivity plastic sealing compound. In addition to the high cost price of high thermal conductivity plastic sealing compound, it also puts forward higher requirements for the control of product plastic packaging process, and The heat dissipation effect is not obvious

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