LED automobile lamp

A technology of LED car lights and LED devices, which is applied in the field of car lights, can solve the problems of high stability requirements, increase the complexity of car light production, increase the difficulty of heat dissipation of LED car lights, etc., achieve stable performance, simple and compact equipment structure , Increase the effect of heat transfer expansion surface

Inactive Publication Date: 2010-09-15
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] LED car headlights have high requirements for stability due to space constraints and vibration during driving, which increase the difficulty of heat dissipation for LED car lights
At present, most of the heat dissipation solutions add heat conduction plates or heat pipes to the lamps, which increases the complexity of lamp production.

Method used

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  • LED automobile lamp
  • LED automobile lamp
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Embodiment Construction

[0018] Below with reference to accompanying drawing, specific embodiment of the present invention is described in more detail:

[0019] A pin-fin type LED automobile lamp, comprising a lamp housing 1, an LED device, a heat-conducting substrate 3 and pin-fins 4, the heat-conducting substrate 3 and the pin-fins 4 are integrally cut, there is no contact thermal resistance, and the heat transfer efficiency is high.

[0020] The pin fins 4 at the center point of the heat conduction substrate 3 are perpendicular to the heat conduction substrate 3, and the pin fins 4 not at the center point of the heat conduction substrate 3 are along the direction connecting the root and the center of the heat conduction substrate 3 and facing away from the center point of the heat conduction substrate 3 One side of the pin fin 4 is bent, and the angle between the tangent line of the pin fin 4 and the heat conduction substrate 3 gradually decreases with the increase of the distance between the root p...

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PUM

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Abstract

The invention discloses an LED automobile lamp comprising a lamp housing, an LED device and a heat conducting substrate, wherein the LED device and the heat conducting substrate are arranged in the lamp housing. The LED automobile lamp is characterized in that the LED device is mated with one face of the heat conducting substrate, the other face of the heat conducting substrate is provided with a pin fin integrated with the heat conducting substrate, and the pin fin is arranged outside the lamp housing. In the pin fin type LED automobile lamp, heat generated by the LED device is directly transmitted to the outside of the automobile lamp through the heat conducting substrate and is then radiated through heat convection with the air outside the automobile lamp through the bent pin fin. The heat conducting substrate and the pin fin are formed by being cut wholly without thermal contact resistance, therefore, high heat transfer efficiency is achieved; in addition, the bent pin fin effectively expands the heat transfer area and improves the heat radiating performance.

Description

technical field [0001] The invention relates to an automobile lamp, in particular to an automobile lamp using LED as a light source. technical background [0002] LED has become the first choice for the new generation of automotive light source technology due to its small size, long life, low energy consumption, shock resistance, and fast start-up time. LED is an injection electroluminescent device. Under the action of an external electric field, the radiative recombination of electrons and holes converts part of the energy into light energy, while the lattice oscillation generated by non-radiative recombination converts the rest of the energy into heat energy. For LEDs to replace traditional light sources in automotive headlights, they must have high power, high efficiency, and high reliability with an operating temperature of -40°C to 125°C. In the realization of these functional requirements, one of the most difficult parts to overcome is the problem of heat dissipation....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/10F21V17/00F21V19/00F21V29/00F21W101/02F21Y101/02F21V29/503F21V29/80F21W107/10
Inventor 陈振乾赵芳
Owner SOUTHEAST UNIV
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