Check patentability & draft patents in minutes with Patsnap Eureka AI!

Dual-end static random access memory (SRMA) unit

A double-terminal, transfer transistor technology, applied in the direction of information storage, static memory, digital memory information, etc., can solve the problems of unfavorable integration of integrated circuits, large area, etc., to avoid reading interference, the number of transistors is small, and the area is saved Effect

Active Publication Date: 2015-06-10
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide a double-terminal SRAM unit to solve the problem that the existing double-terminal 8T SRAM unit is too large, which is not conducive to improving the integration of integrated circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dual-end static random access memory (SRMA) unit
  • Dual-end static random access memory (SRMA) unit
  • Dual-end static random access memory (SRMA) unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The dual-terminal SRAM unit proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0029] The core idea of ​​the present invention is to provide a double-terminal SRAM unit, the double-terminal SRAM unit includes a CMOS inverter, a first PMOS transistor connected to the CMOS inverter, a first PMOS transistor connected to the first PMOS transistor The first resistor, the first transfer transistor connected to the first PMOS transistor, and the second transfer transistor connected to the CMOS inverter, the first transfer transistor is used as a write opera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a dual-end SRAM unit. The SRAM unit comprises a complementary metal-oxide-semiconductor (CMOS) inverter, a first p-channel metal oxide semiconductor (PMOS) transistor, a first resistor, a first transmission transistor and a second transmission transistor, wherein the first PMOS transistor is connected with the COMS inverter; the first resistor is connected with the first PMOS transistor; the first transmission transistor is connected with the first PMOS transistor; the second transmission transistor is connected with the CMOS transistor; and the first transmission transistor is a write-operation transmission transistor and the second transmission transistor is a read-operation transmission transistor. The dual-end SRAM unit provided by the invention only comprises 5 transistors, so the area of the dual-end SRAM unit is greatly reduced; and a resistance value of the first resistor is several magnitude orders greater than the resistance value of the conducted first PMOS transistor and the resistance value of the conducted first transmission transistor and smaller than the resistance value of the closed first PMOS transistor and the resistance value of the closed transmission transistor, so operation of writing '0' and operation of writing '1' can be carried out smoothly.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a double-terminal SRAM unit which can effectively reduce chip area. Background technique [0002] As the functions of digital integrated circuits are becoming more and more complex and the scale is getting larger and larger, on-chip integrated memory has become a very important part of digital systems. Embedded static random access memory (Static Random Access Memory, SRAM) has become an indispensable and important part of on-chip memory due to its advantages of low power consumption and high speed. SRAM can hold data as long as it is powered, there is no need to constantly refresh it. [0003] The overall structure of SRAM can be divided into two parts: memory bank array and peripheral circuit. Among them, the memory bank array is composed of a pre-charging circuit and a memory cell array; the peripheral circuit is composed of a row and column address decoder, a re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/413
Inventor 胡剑
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More