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Heat-conducting medium for LED lamps and manufacturing method thereof

A technology of LED lamps and heat conduction medium, which is applied to the cooling/heating device of lighting device, lighting and heating equipment, lighting device, etc., can solve the problems of reduced thermal conductivity, increased light decay of chips, reduced thermal conductivity, etc. Long service life, good thermal conductivity, and consistent lighting effects

Inactive Publication Date: 2010-10-27
ZHEJIANG JINGHAO OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the thermal resistance, it is necessary to fill the heat conduction medium in the contact interface. The requirements for this filling material: first, it must have certain fluidity or elasticity, so that the gap in the connection interface can be filled during the tight bonding process of the two workpieces; The medium that plays the role of heat conduction cannot have volatile components. Once volatilized, the original heat conduction effect will be greatly reduced; the third is better thermal conductivity
The existing heat conduction medium used for LED lamps generally adopts heat conduction silicone grease, and its thermal conductivity is between 2-4W / m.k. However, the moisture of this material will gradually lose during use and become powdery. It will be greatly reduced, and the light decay of the chip will increase rapidly. If the seal is good, water mist will be formed on the lens, which will affect both the light effect and the light distribution.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] 1. Take graphite powder above 120 mesh;

[0013] 2. Add a small amount of alcohol with a concentration above 90% to the graphite powder to make a paste;

[0014] 3. Print the graphite paste on the contact interface of a workpiece (such as a chip substrate) in the lamp with a screen of more than 100 meshes, and then press another workpiece (such as a radiator) and fasten it.

Embodiment 2

[0016] 1. Take graphite powder above 120 mesh;

[0017] 2. Process graphite powder into graphite paper with certain elasticity;

[0018] 3. After cutting the graphite paper into the size of the contact surface of the workpiece, apply the graphite paper on the contact surface of a workpiece (such as a chip substrate) in the lamp, and then press on another workpiece (such as a radiator) and tighten it.

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Abstract

The invention relates to a method for filling and manufacturing a heat-conducting medium for LED lamps, which comprises: adding alcohol which is volatile and lefts no impurities after volatilization into graphite powder with a particle size of over 120 meshes to prepare paste and printing the paste on a contact interface of a workpiece in the lamp by a silk screen, pressing another workpiece on the contact interface, and fastening the workpieces; or processing elastic graphite paper by using the graphite powder with a particle size of over 120 meshes, sticking the graphite paper on the contact face of one workpiece, pressing the other workpiece on the contact interface, and fastening the workpieces. When the method of the invention is used, the heat conducting effect is good, the service life of the lamp is prolongs, and the light effect is keep consistent due to the long-lasting stability of graphite.

Description

technical field [0001] The invention relates to a method for filling and manufacturing a heat-conducting medium used for LED lamps. Background technique [0002] In the production process of LED lamps, from the perspective of heat transfer, the thermal resistance formed by the contact surface of two closely connected workpieces will be much higher than the thermal resistance inside the same workpiece, and the main reasons for the thermal resistance are two There is a gap at the workpiece contact interface. In order to reduce the thermal resistance, it is necessary to fill the heat conduction medium in the contact interface. The requirements for this filling material: first, it must have certain fluidity or elasticity, so that the gap in the connection interface can be filled during the tight bonding process of the two workpieces; The medium that plays a role in heat conduction cannot have volatile components. Once volatilized, the original heat conduction effect will be gre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21V29/85
Inventor 汪纯燕
Owner ZHEJIANG JINGHAO OPTOELECTRONICS TECH