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Light-emitting diode and back light module

A technology of light-emitting diodes and backlight modules, which is applied in the direction of electrical components, electrical solid-state devices, circuits, etc., can solve the problems of inconsistency, poor light mixing effect, and increase the overall thickness of the original light strip, etc.

Inactive Publication Date: 2010-10-27
AU OPTRONICS CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The package body 122 used by the light-emitting diode 12 is semicircular. The package body 122 includes a substrate 125 and a semicircular reflective layer 124. The semicircular reflective layer 124 is used to increase the efficiency of light output from the front, but this method will cause other problems. Problems: (1) Because the light-emitting diode chip 121 is packaged on it, the light mixing effect will be poor, and the chromaticity of the light directly emitted by the substrate 125 will be different from the chromaticity of the reflected light; (2) This method is limited Therefore, the overall thickness of the original light strip will be increased; (3) the energy of the reflected light will be attenuated again due to the relationship between the substrate 125

Method used

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  • Light-emitting diode and back light module
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  • Light-emitting diode and back light module

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Embodiment Construction

[0019] See image 3 and Figure 4 , image 3 Shown is a schematic perspective view of a light emitting diode according to the present invention, Figure 4 Shown is a schematic cross-sectional view of a light emitting diode according to the present invention. The present invention provides a backlight module, which includes a light-emitting diode 1 and an optical film set (not shown in the figure), etc., wherein the light-emitting diode 1 is used as the light source of the backlight module, and the optical film set (such as a light guide plate or a diffuser plate) etc.) are used to make the distribution of light emitted by the light source more uniform. The light emitting diode 1 includes a package body 2 and a light emitting diode chip 3 . The package 2 is composed of a substrate 21 and a U-shaped case 22 . One end 23 of the U-shaped housing 22 is connected to two ends of the substrate 21 to form an accommodating space for encapsulating the LED chip 3 . The other end 24 ...

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Abstract

The invention provides a light-emitting diode and a back light module. The light-emitting diode comprises a packaging body and a light-emitting diode chip. The packaging body comprises a substrate and a U-shaped case, one end of the U-shaped case is connected with the substrate, and the other end is in a circular structure. The light-emitting diode chip is arranged in the packaging body and is separated from the inner wall of the packaging body. In the invention, the light-emitting diode chip is placed at a distance from the inner wall of the packaging body by using the U-shaped packaging body, so that the number of light reflection is reduced, the light-emitting area is increased, and thus, the overall efficiency of the light-emitting diode is increased.

Description

technical field [0001] The invention relates to a light-emitting diode and a backlight module using the light-emitting diode, in particular to a light-emitting diode with a horseshoe-shaped package body and the backlight module of the light-emitting diode. Background technique [0002] Since the liquid crystal in the liquid crystal display panel does not emit light, in order to achieve the display effect, it is necessary to provide the liquid crystal display panel with a light source device, such as a backlight module, to realize the display function, so the light source is an important component in the backlight module. At present, notebook computers have begun to use a large number of light-emitting diodes (LEDs) as backlight sources. Light-emitting diodes have the advantages of long life, power saving, fast response, high reliability, environmental protection, and safety. The packaging methods are also different. See figure 1 , figure 1 Shown is a schematic diagram of a...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L25/075
Inventor 张正伟黄启祥罗德亨
Owner AU OPTRONICS CORP
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