Touch panel with intermediate conducting layer and manufacturing method thereof
A touch panel and conductive layer technology, applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problem of increasing the thickness and weight of the touch panel, large color difference of the touch panel, and alignment alignment Inaccurate and other issues, to achieve the effect of improving light transmittance and touch sensitivity, reducing etching marks, and reducing thickness and weight
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Embodiment 1
[0028] The thickness of the nameplate layer 1 is 0.7 mm; the thickness of the metal circuit layer 2 is 0.04 microns; the thickness of the middle conductive layer 3 is 0.04 microns, the thickness of the transparent conductive layer 4 is 0.04 microns; the thickness of the substrate layer 5 is 50 microns, the substrate Layer 5 is polycarbonate.
[0029] A method for manufacturing a touch panel with an intermediate conductive layer, each step is carried out under dust-free and dry conditions;
[0030] Step 1: One side of the substrate layer 5 is covered with the transparent conductive layer 4, and the intermediate conductive layer 3 is covered on the transparent conductive layer 4;
[0031] Step 2: electroplate the metal circuit layer 2 on the middle conductive layer 3, and paste a photoresist film on the metal circuit layer 2; wherein, the hollow pattern on the photoresist film matches the traces of the metal traces and the traces of the grid-shaped etching lines;
[0032] Step ...
Embodiment 2
[0037] The thickness of nameplate layer 1 is 1.8 mm; the thickness of metal circuit layer 2 is 0.07 microns; the thickness of intermediate conductive layer 3 is 0.08 microns, the thickness of transparent conductive layer 4 is 0.08 microns; the thickness of substrate layer 5 is 180 microns, the substrate Layer 5 is hardened glass.
[0038] A method for manufacturing a touch panel with an intermediate conductive layer, each step is carried out under dust-free and dry conditions;
[0039] Step 1: One side of the substrate layer 5 is covered with the transparent conductive layer 4, and the intermediate conductive layer 3 is covered on the transparent conductive layer 4;
[0040] Step 2: electroplate the metal circuit layer 2 on the middle conductive layer 3, and paste a photoresist film on the metal circuit layer 2; wherein, the hollow pattern on the photoresist film matches the traces of the metal traces and the traces of the grid-shaped etching lines;
[0041] Step 3: After exp...
Embodiment 3
[0046] The thickness of the nameplate layer 1 is 1.1 mm; the thickness of the metal circuit layer 2 is 0.1 microns; the thickness of the middle conductive layer 3 is 0.1 microns, the thickness of the transparent conductive layer 4 is 0.1 microns; the thickness of the substrate layer 5 is 125 microns, the substrate Layer 5 is polycarbonate.
[0047] A method for manufacturing a touch panel with an intermediate conductive layer, each step is carried out under dust-free and dry conditions;
[0048] Step 1: One side of the substrate layer 5 is covered with the transparent conductive layer 4, and the intermediate conductive layer 3 is covered on the transparent conductive layer 4;
[0049] Step 2: electroplating the metal circuit layer 2 on the middle conductive layer 3, and pasting a photoresist film on the metal circuit layer 2; wherein, the hollow pattern on the photoresist film coincides with the traces of the metal traces and the traces of the grid-shaped etching lines;
[00...
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