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Large touch panel with through holes and manufacture method thereof

A touch panel, large-scale technology, applied in the direction of instruments, electrical digital data processing, data processing input/output process, etc., can solve electronic mechanism failures, affect the operation of the touch panel, easy to generate air bubbles, load changes and Newton Ring and other problems, to achieve the effect of improving support force, penetrating force and sensitivity, and low production cost

Inactive Publication Date: 2010-12-01
牧东光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the wide application of touch panels, the market demand for large-size touch panels is also increasing. However, during the bonding process of large-size touch panels larger than 5 inches, air bubbles are easily generated inside the touch panel body. Bad phenomena such as load changes and Newton rings
Moisture in the air enters between the touch film and the substrate, which not only affects the operation of the touch panel, but may also cause failure of other electronic mechanisms

Method used

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  • Large touch panel with through holes and manufacture method thereof
  • Large touch panel with through holes and manufacture method thereof
  • Large touch panel with through holes and manufacture method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The thickness of the nameplate layer 1 is 0.125 mm; the thickness of the upper conductive pattern layer 2 and the lower conductive pattern layer 3 is 0.045 mm; the thickness of the substrate layer 4 is 0.3 mm, and the substrate layer 4 is hardened glass.

[0028] The method for manufacturing a large-size touch panel with a through hole, the following steps are carried out under dust-free and dry conditions:

[0029] Step 1: The nameplate layer 1 is attached to the upper line conductive pattern layer 2;

[0030] Step 2: Through the middle position of the lower conductive pattern layer 3 and the peripheral part of the substrate layer 4, the laser laser obtains a through hole; the through hole of the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned, and the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned. Lamination of substrate layer 4;

[0031] Step 3: The lower-line conductive pattern ...

Embodiment 2

[0035] The thickness of the nameplate layer 1 is 0.188 mm; the thickness of the upper conductive pattern layer 2 and the lower conductive pattern layer 3 is 0.188 mm; the thickness of the substrate layer 4 is 2.5 mm, and the substrate layer 4 is polycarbonate resin.

[0036] The method for manufacturing a large-size touch panel with a through hole, the following steps are carried out under dust-free and dry conditions:

[0037] Step 1: The nameplate layer 1 is attached to the upper line conductive pattern layer 2;

[0038] Step 2: Through the middle position of the lower conductive pattern layer 3 and the peripheral part of the substrate layer 4, the laser laser obtains a through hole; the through hole of the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned, and the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned. Lamination of substrate layer 4;

[0039] Step 3: The lower-line conductive pat...

Embodiment 3

[0043] The thickness of the nameplate layer 1 is 0.158 mm; the thickness of the upper conductive pattern layer 2 and the lower conductive pattern layer 3 is 0.128 mm; the thickness of the substrate layer 4 is 1.8 mm, and the substrate layer 4 is hardened glass.

[0044] The method for manufacturing a large-size touch panel with a through hole, the following steps are carried out under dust-free and dry conditions:

[0045] Step 1: The nameplate layer 1 is attached to the upper line conductive pattern layer 2;

[0046] Step 2: Through the middle position of the lower conductive pattern layer 3 and the peripheral part of the substrate layer 4, the laser laser obtains a through hole; the through hole of the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned, and the lower conductive pattern layer 3 and the through hole of the substrate layer 4 are aligned. Lamination of substrate layer 4;

[0047] Step 3: The lower-line conductive pattern ...

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Abstract

The invention discloses a large touch panel with through holes and a manufacture method thereof, belonging to the technical field of touch panel composite layer structures and manufacture processes thereof. The large touch panel with through holes comprises a first layer as a nameplate layer, a second layer as a top thread conducting pattern layer, a third layer as a bottom thread conducting pattern layer and a fourth layer as a substrate layer, wherein through holes are arranged at the same positions on the peripheries of the bottom thread conducting pattern layer and the substrate layer. The touch panel is provided with the through holes to realize the sealing state of inner air of the touch panel body and eliminate adverse phenomena of bubbles, load changes, the Newton's ring, and the like which are generated in the touch panel body.

Description

technical field [0001] The invention relates to a large-size touch panel with a through hole and a manufacturing method thereof, and belongs to the technical field of a composite layer structure of a touch panel and its manufacturing process. Background technique [0002] With the wide application of touch panels, the market demand for large-size touch panels is also increasing. However, during the bonding process of large-size touch panels above 5 inches, air bubbles are easily generated inside the touch panel body. Bad phenomena such as load changes and Newton rings. Moisture in the air enters between the touch film and the substrate, which not only affects the operation of the touch panel, but may also cause failures of other electronic mechanisms. [0003] In view of the above technical problems, the present invention adopts the through-hole design to provide space for expansion and deformation of the touch panel during hot pressing and cooling, so that the touch panel ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
Inventor 姚益明李世强
Owner 牧东光电科技有限公司
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