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Method for externally expanding single edge of circuit of touch panel

A touch panel, unilateral technology, used in chemical/electrolytic methods to remove conductive materials, data processing input/output processes, instruments, etc. The effect of electrical signal transmission, strong operation controllability, and reduction of manufacturing costs

Inactive Publication Date: 2010-12-08
牧东光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of processing the touch panel, it is easy for the metal line electrode to deviate from the end of the conductive area.

Method used

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  • Method for externally expanding single edge of circuit of touch panel
  • Method for externally expanding single edge of circuit of touch panel
  • Method for externally expanding single edge of circuit of touch panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The thickness of the nameplate layer is 0.7 mm; the thickness of the metal conductive material is 0.05 micron; the thickness of the transparent conductive material is 0.045 micron; the thickness of the substrate layer is 50 micron, and the substrate layer is polycarbonate resin.

[0024] The method for unilateral expansion of the touch panel circuit includes the following steps to be carried out under dust-free and dry conditions;

[0025] Step 1: electroplating metal conductive material on the surface of transparent conductive material;

[0026] Step 2: paste a photoresist film on the metal conductive material, expose, develop and etch to form a metal trace; at room temperature, etch the metal conductive material with a mixed solution of sulfuric acid and hydrogen peroxide to obtain a metal trace;

[0027] Step 3: first attach a photoresist film on the metal traces, wherein the width of the photoresist film on a single metal trace is 65 microns; then, expose and develo...

Embodiment 2

[0031] The thickness of the nameplate layer is 1.8 mm; the thickness of the metal conductive material is 0.1 micron; the thickness of the transparent conductive material is 0.1 micron; the thickness of the substrate layer is 180 micron, and the substrate layer is hardened glass.

[0032] The method for unilateral expansion of the touch panel circuit includes the following steps to be carried out under dust-free and dry conditions;

[0033] Step 1: electroplating metal conductive material on the surface of transparent conductive material;

[0034] Step 2: paste a photoresist film on the metal conductive material, expose, develop and etch to form a metal trace; at room temperature, etch the metal conductive material with a mixed solution of sulfuric acid and hydrogen peroxide to obtain a metal trace;

[0035] Step 3: first attach a photoresist film on the metal traces, wherein the width of the photoresist film on a single metal trace is 75 microns; then, expose and develop to et...

Embodiment 3

[0039] The thickness of the nameplate layer is 1.1 mm; the thickness of the metal conductive material is 0.09 microns; the thickness of the transparent conductive material is 0.08 microns; the thickness of the substrate layer is 125 microns, and the substrate layer is polycarbonate resin.

[0040] The method for unilateral expansion of the touch panel circuit includes the following steps to be carried out under dust-free and dry conditions;

[0041] Step 1: electroplating metal conductive material on the surface of transparent conductive material;

[0042] Step 2: paste a photoresist film on the metal conductive material, expose, develop and etch to form a metal trace; at room temperature, etch the metal conductive material with a mixed solution of sulfuric acid and hydrogen peroxide to obtain a metal trace;

[0043] Step 3: first attach a photoresist film on the metal traces, wherein the width of the photoresist film on a single metal trace is 70 microns; then, expose and dev...

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Abstract

The invention relates to a method for externally expanding a single edge of a circuit of a touch panel, belonging to the technical field of manufacture of touch panels. The method comprises the following steps of: directly electroplating a metal conducting material on a transparent conducting material, adhering a photoresist film on the metal conducting material, exposing, developing and etching to form metal routings. The operating method has strong controllability and simple process flows. The manufacturing cost can be decreased. The width of the photoresist film is externally expanded with respect to the width of the metal routings, which effectively protects the corrosion of the metal routings and is beneficial to the signal transmission.

Description

technical field [0001] The invention relates to a method for unilateral expansion of a circuit of a touch panel, belonging to the technical field of touch panel production. Background technique [0002] During the process of processing the touch panel, it is easy for the metal line electrode to deviate from the end of the conductive area. The present invention can perform photoresist etching on layers of different depths of the touch panel by using a photoresist process to obtain corresponding patterns. For example, metal conductive materials are directly plated on transparent conductive materials, a photoresist film is pasted on the metal conductive materials, exposed, developed and etched to form metal traces; this operation method is highly controllable, the process flow is simple, and the manufacturing cost can be reduced. [0003] When processing transparent conductive materials, use photoresist technology to etch transparent conductive materials to form grid pattern n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041H05K3/06
CPCG06F2203/04103G06F3/041G06F2203/04112
Inventor 陈栋南
Owner 牧东光电科技有限公司
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