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Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method

A technology of pretreatment liquid and copper alloy, applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve the problems of low biodegradability, low environmental protection, insufficient lateral corrosion inhibition ability, and increased etching speed, etc. effect, suppressing residual defects, increasing the effect of side etching

Inactive Publication Date: 2010-12-08
MITSUBISHI PAPER MILLS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technology is not only insufficient in suppressing side erosion, but also has serious problems in environmental protection, such as the use of azole compounds that are generally low in biodegradability.
[0009] Further, Japanese Patent Application Laid-Open No. 53-30435 proposes an etching method in which a specific amount of oxalic acid or hydroxycarboxylic acid is added to an etching solution mainly composed of iron (III) chloride or copper (II) chloride. However, the above-mentioned etching liquid is not an etching liquid for the purpose of precision processing required in recent years. When it is used for the manufacture of a printed circuit board with a fine pitch as described above, if the etching progresses to a certain extent, the etching speed will increase sharply. And the line width becomes thinner sharply, in fact, it is impossible to control the etching

Method used

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  • Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method
  • Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method
  • Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064]

[0065] Add 27 g (10 g as anhydrous) and 0.70 g of oxalic acid dihydrate (0.50 g as anhydrous) of a commercially available 40° Baume degree ferric (III) chloride aqueous solution (concentration: 37% by mass) 1 kg of water was used to prepare an etching solution containing 1.0% by mass of iron (III) chloride and 0.050% by mass of oxalic acid.

[0066]

[0067] On the surface of a copper-clad laminate bonded with a glass epoxy base material (FR-4 standard) with a thickness of 1.6 mm and an electrolytic copper foil with a thickness of 12 μm, apply and dry a positive-type liquid resist so that the dried The thickness is 6 μm. Then, after exposing the pattern for evaluation whose line / space width was 15 μm / 15 μm, development and water washing were performed to form a resist pattern, and the material to be etched 1 was produced.

[0068]

[0069] Use the above-mentioned etchant adjusted to 30°C, use a conical nozzle with a diameter of 6.0cm on the spray surface, suppl...

Embodiment 2～8

[0071] In the same manner as in Example 1, an etching solution containing iron (III) chloride and oxalic acid at the concentrations shown in Table 1 and Table 2 was prepared, and the same etched material as in Example 1 was subjected to spray etching under prescribed spray conditions. Determination (1) w 2 =w 3 (15μm) injection time X (seconds), (2) w when the injection time is 1.2 times X 1 and w 2 , (3) w when the injection time is 2.0 times of X 1 and w 2 , and the results are shown in Tables 1 and 2.

Embodiment 9

[0083]

[0084] 13.5 kg (5.00 kg as anhydrous), 1.40 kg of oxalic acid dihydrate (1.00 kg as anhydrous) of commercially available 40° Baume degree ferric (III) chloride aqueous solution (concentration: 37% by mass) Water was added to form 100 kg, and 100 kg of etching solution containing 5.0 mass % of iron (III) chloride and 1.0 mass % of oxalic acid were prepared.

[0085]

[0086] 20 g of sulfuric acid (concentration: 98% by mass) was added to 980 g of water, and the mixture was well mixed to prepare a pretreatment liquid having a concentration of 2.0% by mass.

[0087]

[0088] A positive-type liquid resist was applied and dried to a thickness of 6 μm after drying on a copper-clad laminate of an electrolytic copper foil bonded to a polyimide insulating material with a thickness of 40 μm and a copper foil with a thickness of 9 μm. among them, forming figure 2 The material to be etched 2 was produced by using the comb-shaped wiring for evaluation as shown in the resis...

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Abstract

Disclosed is an etchant which contains (1) 1-20% by mass of iron (III) chloride and (2) 5-100% by mass of oxalic acid relative to the iron (III) chloride, while containing water as a main component. Also disclosed is an etching method using the etchant. In the etching method, a pretreatment is performed by using an aqueous solution containing at least one component selected from the group consisting of acids and substances dissolving copper or a copper alloy. Consequently, the etching method achieves high yield.

Description

technical field [0001] The present invention relates to an etching solution for copper or copper alloy, a pre-etching treatment solution for copper or copper alloy, and a copper or copper alloy using the etching solution or the pre-etching treatment solution suitable for high-density printed circuit board manufacturing etching method. Background technique [0002] In recent years, miniaturization and high functionality of electronic devices have rapidly progressed, and printed circuit boards incorporated in these devices are strongly required to have high circuit density. [0003] As a method of manufacturing printed circuit boards, it is widely used to form a resist pattern on a substrate bonded with copper foil in advance by screen printing, optical lithography, etc., and use an etching solution such as an aqueous solution of iron (III) to remove unnecessary Part of the copper foil, the so-called subtractive method of manufacturing conductor patterns. However, it is know...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/00
CPCH05K2203/1476H05K3/067C23F1/18H05K2203/0392
Inventor 加藤真丰田裕二中川邦弘石田麻里子金田安生
Owner MITSUBISHI PAPER MILLS LTD
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