Flat-panel detector structure

Abstract

The invention relates to a flat-panel detector structure which comprises an outer shell, an inner shell, a flat panel, a PCB and a ray blocking layer, wherein the outer shell is provided with a detector window; the inner shell is installed in the outer shell by a shock absorption structure; the flat panel is arranged in the inner shell, is positioned right below the detector window and is isolated from the inner shell by a buffer layer or a buffer unit; the PCB is installed in the outer shell and is electrically connected with the flat panel; and the ray blocking layer is arranged between the flat panel and the PCB. By overhanging the inner shell and connecting the inner shell with the outer shell through only several flexible connection points, the invention forms a gap layer between the inner shell and outer shell, thereby achieving the heat insulation and vibration-proof protection effects on the flat panel. In addition, the inner shell and the outer shell are in flexible connection, thereby achieving the effect of fixing the inner shell and buffering the influence of external impact on the inner shell.

Description

technical field [0001] The invention relates to a flat panel detector structure. Background technique [0002] Since the launch of the first flat panel detector (Flat Panel Detector) equipment on RSNA in 1995, with the rapid development of flat panel detection technology in recent years, in the development and production process of flat panel detectors, flat panel detection technology can be divided into direct and indirect categories. The structure of the indirect FPD is mainly composed of a scintillator or phosphor layer, an amorphous silicon layer (a-Si) with a photodiode function, and a thin film semiconductor array (Thin Film Transistor array, TFT). The principle is that after the scintillator or phosphor layer is exposed to X-rays, the X-ray photons are converted into visible light, and then the amorphous silicon layer with a photodiode function is converted into an image electrical signal, and finally a digital image is obtained. The structure of the direct FPD is m...

AI Technical Summary

Problems solved by technology

Although this structure also has a buffer setting, but because the panel is in direct contact with the shell in structure, it still faces the disadvantages that the panel is vulnerable to external impact and easily affected by the heating of the circuit part.

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