Production method of FCCL (Flexible Copper Clad Laminate) release paper

A manufacturing method and technology of release paper, applied in the direction of paper, papermaking, special paper, etc., can solve the problems of poor high temperature and high pressure resistance, low hardness, unstable release paper, etc., and achieve strong tensile and compressive resistance, durability Good aging effect and stable release effect

Active Publication Date: 2012-06-06
朱锦佐
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, domestic release paper is mainly coated with release agent such as silicone oil or self-adhesive. Such release paper has low hardness, unstable release, and high temperature resistance in the production process of FCCL. Problems such as poor high pressure performance

Method used

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Embodiment Construction

[0011] A kind of manufacture method of FCCL release paper is characterized in that: manufacture according to the following steps:

[0012] A. Carry out corona pretreatment on the base paper of the release paper that can enhance its adhesive strength;

[0013] B. Mix HD and LD polyethylene evenly in a mass ratio of 1:1.5~2, heat and melt, and coat the base paper after corona pretreatment. The amount of polyethylene coating is not less than 20g / m 2 , to obtain coated paper after cooling;

[0014] C. Apply a non-silicon-based release agent with a concentration of 1%-1.5% by mass and a temperature of 50-60°C evenly on one or both sides of the coated paper;

[0015] D. Dry the coated paper coated with a non-silicon-based release agent at 65-90°C in sections, and cool down after drying to obtain the product.

[0016] As a preferred embodiment, when choosing a release base paper, it is best to choose a smoothness greater than 80 seconds, a longitudinal tensile strength greater than...

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PUM

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Abstract

The invention discloses a production method of an FCCL (Flexible Copper Clad Laminate) release paper, comprising the following steps of: carrying out corona preprocessing on a base paper of the release paper; uniformly mixing HD (High Density) polyethylene and LD (Low Density) polyethylene according to the mass ratio of 1:1.5-2, heating for fusion, coating a film to the preprocessed base paper, and cooling to obtain a film coated paper, wherein the film coating amount of the polyethylene is not less than 20g / m<2>; uniformly coating a non-silicon system separant with the mass percentage concentration of 1-1.5 percent and the temperature of 50-60 DEG C on one surface or two surfaces of the film coated paper; drying the film coated paper coated with the non-silicon system separant in segments at 65-90 DEG C, and then cooling to obtain the product. The FCCL release paper produced by using the process method has stable release, good aging resistant effect and high tension and pressure resistant capacity and can achieve good using effect in severer environments, i.e. a high-temperature environment, a high-pressure environment, and the like.

Description

technical field [0001] The invention relates to a method for manufacturing release paper, in particular to a method for manufacturing FCCL release paper. Background technique [0002] FCCL is the abbreviation of flexible copper clad laminate, which is the production material of flexible circuit board. This material has been monopolized by foreign countries. Domestic substitutes have been used, but the effect has been unsatisfactory, mainly because of poor stability and prone to quality problems, such as There are unclear lines and adhesions, resulting in high scrap rates and other disadvantages. Release paper is specially used on FCCL, it can play the role of high temperature resistance, moisture resistance, oil resistance and tensile strength. At present, domestic release paper is mainly coated with release agent such as silicone oil or self-adhesive. Such release paper has low hardness, unstable release, and high temperature resistance in the production process of FCCL. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D21H27/00D21H23/22D21H21/14
Inventor 朱锦佐
Owner 朱锦佐
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