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Manufacturing method of panel-type heat pipe

The invention relates to a technology of a flat-plate heat pipe and a manufacturing method, which are applied in the field of heat pipe manufacturing, and can solve the problems of large thermal resistance and poor heat dissipation performance of the flat-plate heat pipe, and achieve the effects of small thermal resistance and good heat transfer performance.

Inactive Publication Date: 2011-01-12
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal resistance between the heat sink and the upper cover of the flat heat pipe is relatively large, so the heat dissipation performance of the flat heat pipe is not good.

Method used

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  • Manufacturing method of panel-type heat pipe
  • Manufacturing method of panel-type heat pipe
  • Manufacturing method of panel-type heat pipe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Figure 1 to Figure 3 Shown is a flat heat pipe 100 according to a first embodiment of the present invention. The flat heat pipe 100 is made by powder injection molding technology, and the specific steps are as follows:

[0024] (1) A mold 10 is provided, and the mold 10 has a first cavity 11 and six second cavities 13 located in the upper middle of the first cavity 11 and communicating with it, arranged at equal intervals. The shape of the cavity jointly formed by the first and second mold cavities 11 and 13 is equivalent to the outer dimension of the flat heat pipe 100 . It can be understood that the shapes of the first cavity 11 and the second cavity 13 can be cuboid, cylinder or other geometric shapes, and in this embodiment, they are all cuboid.

[0025] (2) A two-color molding injection machine (not shown in the figure) is provided, and the two-color molding injection machine has two injection systems in independent directions.

[0026] (3) Provide a first meta...

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Abstract

The invention discloses a manufacturing method of a panel-type heat pipe, comprising the following steps: providing a mould which is provided with a first cavity and a plurality of second cavities communicated with the first cavity; providing first metal powder, second metal powder and binder mixed with the metal powder; providing a plurality of deorienting fillers arranged at interval, causing the fillers to be arranged in the first cavity and the second cavities and to be arranged at interval with each inner wall surface of the first cavity and the second cavities; injecting the first metalpowder and the second metal powder into the first cavity and the second cavities of the moulds in order; removing the deorienting fillers so as to form a flake; sintering the flake at high temperature; causing the first metal powder to form the continuous outer cavity of the panel-type heat pipe; causing the second metal powder to form continuous capillary structure formed on the inner surface ofthe outer cavity and a plurality of porous shores; then forming a brown embryo; vacuumizing the brown embryo, injecting operating fluid, and processing a seal to obtain the panel-type heat pipe.

Description

technical field [0001] The invention relates to a method for manufacturing a heat pipe, in particular to a method for manufacturing a flat heat pipe. Background technique [0002] At present, heat pipes are commonly used in the industry to solve the high-density heat dissipation problem of high-speed computers, such as heat pipes, loop heat pipes, and flat heat pipes (Vapor Chamber) and other products. [0003] The working principle of the flat heat pipe is the same as that of the traditional heat pipe. Because it has a larger heat conduction area than the traditional heat pipe, and meets the high practical value of "light, thin, short, and small", it is widely used in electronic products with large heat dissipation surfaces. superior. [0004] A general flat heat pipe has an upper cover plate prepared by a stamping process, a lower cover plate matched with the upper cover plate, and a capillary structure between the upper cover plate and the lower cover plate. The upper a...

Claims

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Application Information

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IPC IPC(8): B22F5/12B22F3/115F28D15/02B22F1/05
CPCB22F7/06F28D15/0233F28F3/022H01L21/4871B22F1/0011F28F2255/18F28D15/046B22F3/225H01L23/427H01L2924/0002B22F1/05H01L2924/00
Inventor 侯春树
Owner FU ZHUN PRECISION IND SHENZHEN
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