Insulating layer, printed circuit board with electronic component and producing method thereof

Abstract

The invention discloses a printed circuit board with electronic component and producing method thereof. The method comprises steps of providing the circuit pattern chip plate which is disposed on the surface and is penetrated by a hollow cavity; bonding an adhesion layer to the lower surface of the chip plate to cover the hollow cavity; disposing an electronic component on the upper surface of the adhesion layer, corresponding to the position of the hollow cavity; stacking a first insulating layer which dose not have supporting materials filled in the hollow cavity on the upper surface of thechip plate to cover the circuit pattern so that the hollow cavity is filled; stacking a second insulating layer which has supporting materials filled in the hollow cavity on the upper side and the lower side of the chip plate.

Description

[0001] References to related applications [0002] This application claims the priority of Korean Patent Application No. 10-2009-0062095 and No. 10-2009-0114119 filed with the Korean Intellectual Property Office on July 8, 2009 and November 24, 2009, respectively, the disclosure of which is in its entirety The contents are hereby incorporated by reference. technical field [0003] The invention relates to an insulating layer, a printed circuit board embedded with electronic components and a manufacturing method of the printed circuit board. Background technique [0004] With the development of the electronics industry, there is an increasing demand for smaller and more functional electronic components. Specifically, market trends based on lighter, thinner, shorter and smaller personal mobile devices have resulted in thinner printed circuit boards. As a result, component mounting methods different from conventional methods have emerged. An example is an embedded printed ci...

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Problems solved by technology

[0008] The present invention provides an insulating substrate, a printed circuit board embedded with electronic components, and a method of manufacturing the printed circuit board even in the case where a lay-up process is performed by using a thin insulating layer , can also avoid voids generated around electronic components and between circuit patterns due to reduction in resin content, and can solve the problem of deformation of electronic components caused by support materials filled in insulating layers during cladding processing

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