Plasma processing apparatus

A plasma and treatment device technology, applied in the field of plasma treatment devices, can solve the problems of electrode damage, shape deformation of discharge space, electrode deformation, etc., and achieves the effects of not easy insulation breakdown, improved stability, and suppression of deformation.

Inactive Publication Date: 2011-01-26
松下电工神视株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the plasma processing apparatus as described above, if the positioning of the facing electrodes is incorrect, or the electrodes are deformed due to the heat generated by the plasma discharge, so that the shape of the discharge space is deformed, the following problems may occur. That is, the expected performance cannot be obtained, or the electrode may be damaged due to the cessation of discharge, abnormal discharge, or abnormal discharge concentration.
[0006] In addition, when the electrodes of the above-mentioned plasma processing apparatus are u

Method used

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Examples

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Example Embodiment

[0061] Embodiment 1

[0062] Reference Figure 1 ~ Figure 5 (a) Figure 5(b) illustrates the first embodiment of the present invention. The up and down direction in the following description corresponds to figure 2 In the up and down direction.

[0063] figure 1 , figure 2 An example of the plasma processing apparatus A of this embodiment is shown. The plasma processing apparatus A includes a discharge vessel 30 composed of a plurality of coated electrodes 3 facing each other, a power source 5, and a heat sink 6.

[0064] The clad electrode 3 is formed by embedding the conductive layer 2 in an insulating substrate (multilayer substrate) 1 having a substantially flat plate shape. The insulating substrate 1 is a substrate formed of a ceramic sintered body of an insulating material (dielectric material) with a high melting point. For example, the insulating substrate 1 can be made of alumina, zirconia, or aluminum red. Although it is formed of a ceramic sintered body with high heat...

Example Embodiment

[0086] Embodiment 2

[0087] Reference Image 6 The second embodiment of the present invention will be described. In this embodiment, a cooling fan (fan) 63 is provided around the heat dissipation fin 62 as a cooling unit, and the other configuration is the same as that of the first embodiment. The same reference numerals are attached to the components common to the above-mentioned first embodiment, and the description is omitted.

[0088] In this embodiment, the cooling fan 63 is provided so as to face the heat dissipation fin 62. In this embodiment, the cooling fan 63 is operated, thereby, compared with cooling the coated electrode 3 using only the heat dissipation fins 62, the coated electrode 3 can be cooled more efficiently, and the coated electrode 3 can be cooled. The covered electrode 3 is less likely to be damaged or the like. Furthermore, the operation and stop of the cooling fan 63 can be controlled as necessary based on the measurement result of the temperature of th...

Example Embodiment

[0089] Embodiment 3

[0090] Reference Figure 7 Next, a third embodiment of the present invention will be described. In this embodiment, the heat sink 6 is formed by a cooling jacket 64 instead of the contact portion 61 and the heat dissipation fin 62, and the other configuration is the same as that of the first embodiment. The same reference numerals are attached to the components common to the above-mentioned first embodiment, and the description is omitted.

[0091] Such as Figure 7 As shown, the cooling jacket 64 of this embodiment is also provided with a positioning hole B communicating with the spacer portion 31 of the coated electrode 3. In addition, as in the first embodiment, the covered electrode 3 and the cooling jacket 64 are pressure-contacted to each other by the bolt 71, the nut 72, and the coil spring 73.

[0092] The cooling jacket 64 is formed of the same material as the heat dissipation fin 62 of the first embodiment and formed into a plate shape. Inside the co...

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Abstract

The invention discloses a plasma processing apparatus, which is provided with a positioning hole (B) in communication with a cladding electrode (3) and a radiator (6). A bolt (71) is inserted through the positioning hole (B) to correctly and easily realize the positioning of the cladding electrode (3). Additionally, a spiral spring (73) is arranged between the head (71a) of the bolt (71) and the radiator (6). In this way, a clearance caused by elastic force of the spiral spring (73) is present between the head (71a) and the radiator (6). As a result, the cladding electrode (3) can be deformed.

Description

technical field [0001] The present invention relates to a plasma processing device, which is used for cleaning (cleaning), stripping and etching (etching) of photoresist (photoresist, resist), organic Improvement of film adhesion, reduction of metal oxides, film formation, plating pretreatment, coating pretreatment, coating pretreatment, surface modification of various materials and parts, etc. In processing, the plasma processing apparatus is particularly suitable for cleaning the surface of electronic parts requiring precision bonding. Background technique [0002] In the prior art, a plurality of electrodes are arranged facing each other, the space between the electrodes is formed as a discharge space, gas for generating plasma (plasma) is supplied to the discharge space, and a voltage is applied between the electrodes. In this way, a discharge is generated in the discharge space to generate plasma, and the plasma or active species of the plasma is ejected from the disch...

Claims

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Application Information

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IPC IPC(8): H05H1/24H05H1/28
CPCH01J37/32559
Inventor 中园佳幸弓削政郎
Owner 松下电工神视株式会社
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