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Circuit substrate

A circuit substrate and circuit layer technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve problems such as inability to carry out

Active Publication Date: 2013-01-02
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, solder nonstick testing is not possible due to the removal of these plating lines

Method used

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  • Circuit substrate
  • Circuit substrate
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Experimental program
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Effect test

Embodiment Construction

[0030] figure 1 It is a schematic top view of the outer circuit layer of the circuit substrate according to an embodiment of the present invention, figure 2 It is a schematic top view of the inner circuit layer of the circuit substrate according to the embodiment of the present invention, image 3 It is the circuit substrate of the embodiment of the present invention along the figure 1 Partial structural cross-sectional view of the AA' line, Figure 4 It is the circuit substrate of the embodiment of the present invention along the figure 2 Partial structural cross-sectional view of the BB' line, Figure 5 It is the circuit substrate of the embodiment of the present invention along the figure 1 Partial structural cross-sectional view of the CC' line. combine figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 The circuit substrate of this embodiment includes an outer circuit layer 110 , an inner circuit layer 120 , a dielectric layer 130 , a first conductive h...

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Abstract

The invention relates to a circuit substrate comprising an external circuit layer, an internal circuit layer, a dielectric layer, a first conductive hole and a second conductive hole, wherein the external circuit layer comprises a first signal circuit, a first test circuit and a test contact conducted with the first test circuit; the internal circuit layer comprises a second signal circuit, a second test circuit and a first connecting circuit connected between the second signal circuit and the second test circuit; the dielectric layer is arranged between the external circuit layer and the internal circuit layer; the first conductive hole is arranged in the dielectric layer; the first conductive hole is used for conducting the first test circuit and the second test circuit; a second conductive hole is arranged in the dielectric layer; and the second conductive hole is used for conducting the first signal circuit and the second signal circuit. The circuit substrate provided by the invention can be subject to an open circuit / short circuit test. Moreover, a routing contact of the first signal circuit can be conducted with a test contact arranged on the external circuit layer so that awelding non-adhesion test can be carried out.

Description

technical field [0001] The invention relates to a circuit substrate, in particular to a circuit substrate used for open / short test and non-stick test. Background technique [0002] Currently, in semiconductor packaging technology, a circuit substrate is one of the frequently used assembly components. The circuit substrate is mainly composed of multiple patterned conductive layers and multiple dielectric layers laminated alternately, and the two circuit layers can be electrically connected through conductive vias. [0003] When the circuit board is used in the wire bonding process of chip packaging, in order to improve the yield rate of the wire bonding process of the circuit board, it is necessary to carry out a non-stick test on the circuit board, and according to the bonding of the wire and the pad According to the situation to adjust the process parameters. In addition, as the circuit density of the circuit substrate increases continuously, it becomes very difficult to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L23/48H01L23/12
Inventor 洪坤廷
Owner ADVANCED SEMICON ENG INC